IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
514-83-256M20-001148

514-83-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2,287
RFQ
514-83-256M20-001148

Datasheet

514 Bulk Active BGA 256 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-299-20-001112

614-87-299-20-001112

CONN SOCKET PGA 299POS GOLD

Preci-Dip

2,867
RFQ
614-87-299-20-001112

Datasheet

614 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-91-209-17-081003

510-91-209-17-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,473
RFQ
510-91-209-17-081003

Datasheet

510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
120-PGM13015-40

120-PGM13015-40

CONN SOCKET PGA GOLD

Aries Electronics

2,764
RFQ
120-PGM13015-40

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-83-238-19-101112

614-83-238-19-101112

CONN SOCKET PGA 238POS GOLD

Preci-Dip

1,402
RFQ
614-83-238-19-101112

Datasheet

614 Bulk Active PGA 238 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
133-PGM14014-40

133-PGM14014-40

CONN SOCKET PGA GOLD

Aries Electronics

1,720
RFQ
133-PGM14014-40

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
133-PGM14014-50

133-PGM14014-50

CONN SOCKET PGA GOLD

Aries Electronics

3,394
RFQ
133-PGM14014-50

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0840-G-T

APH-0840-G-T

APH-0840-G-T

Samtec Inc.

2,809
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1340-G-T

APH-1340-G-T

APH-1340-G-T

Samtec Inc.

2,866
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0940-G-T

APH-0940-G-T

APH-0940-G-T

Samtec Inc.

4,902
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0440-G-T

APH-0440-G-T

APH-0440-G-T

Samtec Inc.

2,912
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1840-G-T

APH-1840-G-T

APH-1840-G-T

Samtec Inc.

2,856
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0540-G-T

APH-0540-G-T

APH-0540-G-T

Samtec Inc.

4,545
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0640-G-T

APH-0640-G-T

APH-0640-G-T

Samtec Inc.

1,158
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1740-G-T

APH-1740-G-T

APH-1740-G-T

Samtec Inc.

3,153
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0740-G-T

APH-0740-G-T

APH-0740-G-T

Samtec Inc.

3,294
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1140-G-T

APH-1140-G-T

APH-1140-G-T

Samtec Inc.

2,010
RFQ

-

* - Active - - - - - - - - - - - - - - -
510-13-096-11-041001

510-13-096-11-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,168
RFQ
510-13-096-11-041001

Datasheet

510 Tube Active PGA 96 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6556-40

28-6556-40

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,810
RFQ
28-6556-40

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
116-43-964-61-008000

116-43-964-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,548
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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