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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
APH-1728-G-R APH-1728-G-R Samtec Inc.	3,298	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
48-3574-11 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	1,349	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
HLS-0513-G-38 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	3,853	-	RFQ	Datasheet	HLS	Bulk	Active	SIP	65 (5 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
510-13-089-12-051001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,217	-	RFQ	Datasheet	510	Bulk	Active	PGA	89 (12 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-93-153-15-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,525	-	RFQ	Datasheet	510	Bulk	Active	PGA	153 (15 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-13-640-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,977	-	RFQ	-	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APH-1836-G-R APH-1836-G-R Samtec Inc.	4,309	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0536-G-R APH-0536-G-R Samtec Inc.	1,613	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1436-G-R APH-1436-G-R Samtec Inc.	2,142	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0936-G-R APH-0936-G-R Samtec Inc.	4,869	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1036-G-R APH-1036-G-R Samtec Inc.	4,919	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1536-G-R APH-1536-G-R Samtec Inc.	4,989	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0736-G-R APH-0736-G-R Samtec Inc.	1,188	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0836-G-R APH-0836-G-R Samtec Inc.	1,975	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0336-G-R APH-0336-G-R Samtec Inc.	1,312	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1636-G-R APH-1636-G-R Samtec Inc.	3,633	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0436-G-R APH-0436-G-R Samtec Inc.	1,232	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0636-G-R APH-0636-G-R Samtec Inc.	2,262	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
48-3570-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	2,612	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-3571-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	1,276	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-

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