IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
48-3573-11

48-3573-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

1,545
RFQ
48-3573-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3575-11

48-3575-11

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2,897
RFQ
48-3575-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6570-11

48-6570-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

4,851
RFQ
48-6570-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6571-11

48-6571-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2,566
RFQ
48-6571-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6572-11

48-6572-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

1,275
RFQ
48-6572-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6573-11

48-6573-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

1,680
RFQ
48-6573-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6575-11

48-6575-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,573
RFQ
48-6575-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
324-13-164-41-002000

324-13-164-41-002000

SOCKET 4 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

3,827
RFQ
324-13-164-41-002000

Datasheet

324 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
MHAS-181-ZMGG-15

MHAS-181-ZMGG-15

CONN SOCKET BGA 181POS GOLD

Samtec Inc.

3,418
RFQ
MHAS-181-ZMGG-15

Datasheet

MHA Bulk Obsolete BGA 181 (15 x 15) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - - -
48-6503-21

48-6503-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

4,606
RFQ
48-6503-21

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
517-83-475-21-121111

517-83-475-21-121111

CONN SOCKET PGA 475POS GOLD

Preci-Dip

3,780
RFQ
517-83-475-21-121111

Datasheet

517 Bulk Active PGA 475 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-364-17-091147

546-87-364-17-091147

CONN SOCKET PGA 364POS GOLD

Preci-Dip

4,082
RFQ
546-87-364-17-091147

Datasheet

546 Bulk Active PGA 364 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0930-G-H

APH-0930-G-H

APH-0930-G-H

Samtec Inc.

4,068
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1430-G-H

APH-1430-G-H

APH-1430-G-H

Samtec Inc.

3,097
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0530-G-H

APH-0530-G-H

APH-0530-G-H

Samtec Inc.

2,281
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1530-G-H

APH-1530-G-H

APH-1530-G-H

Samtec Inc.

1,116
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1930-G-H

APH-1930-G-H

APH-1930-G-H

Samtec Inc.

1,735
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1230-G-H

APH-1230-G-H

APH-1230-G-H

Samtec Inc.

4,329
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0730-G-H

APH-0730-G-H

APH-0730-G-H

Samtec Inc.

3,442
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1330-G-H

APH-1330-G-H

APH-1330-G-H

Samtec Inc.

3,223
RFQ

-

* - Active - - - - - - - - - - - - - - -
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