IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
550-10-356M26-001166

550-10-356M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

3,346
RFQ
550-10-356M26-001166

Datasheet

550 Bulk Active BGA 356 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
116-43-952-61-001000

116-43-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,394
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-952-61-001000

116-93-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,930
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-83-528-21-121111

517-83-528-21-121111

CONN SOCKET PGA 528POS GOLD

Preci-Dip

4,468
RFQ
517-83-528-21-121111

Datasheet

517 Bulk Active PGA 528 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
44-3571-11

44-3571-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

4,552
RFQ
44-3571-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3575-11

44-3575-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

4,357
RFQ
44-3575-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
510-13-100-10-000001

510-13-100-10-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,130
RFQ
510-13-100-10-000001

Datasheet

510 Bulk Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-10-357M19-001166

550-10-357M19-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

1,577
RFQ
550-10-357M19-001166

Datasheet

550 Bulk Active BGA 357 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-1338-G-R

APH-1338-G-R

APH-1338-G-R

Samtec Inc.

1,498
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1838-G-R

APH-1838-G-R

APH-1838-G-R

Samtec Inc.

1,758
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0938-G-R

APH-0938-G-R

APH-0938-G-R

Samtec Inc.

3,295
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1038-G-R

APH-1038-G-R

APH-1038-G-R

Samtec Inc.

2,204
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1938-G-R

APH-1938-G-R

APH-1938-G-R

Samtec Inc.

4,135
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0238-G-R

APH-0238-G-R

APH-0238-G-R

Samtec Inc.

1,065
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0838-G-R

APH-0838-G-R

APH-0838-G-R

Samtec Inc.

3,919
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0738-G-R

APH-0738-G-R

APH-0738-G-R

Samtec Inc.

3,399
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0438-G-R

APH-0438-G-R

APH-0438-G-R

Samtec Inc.

4,239
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1738-G-R

APH-1738-G-R

APH-1738-G-R

Samtec Inc.

1,999
RFQ

-

* - Active - - - - - - - - - - - - - - -
514-83-419-19-001154

514-83-419-19-001154

CONN SOCKET PGA 419POS GOLD

Preci-Dip

4,277
RFQ
514-83-419-19-001154

Datasheet

514 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-1008-G-2

HLS-1008-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,389
RFQ
HLS-1008-G-2

Datasheet

HLS Bulk Active SIP 80 (10 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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