IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
546-87-365-14-000147

546-87-365-14-000147

CONN SOCKET PGA 365POS GOLD

Preci-Dip

4,788
RFQ
546-87-365-14-000147

Datasheet

546 Bulk Active PGA 365 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-365-17-091147

546-87-365-17-091147

CONN SOCKET PGA 365POS GOLD

Preci-Dip

1,273
RFQ
546-87-365-17-091147

Datasheet

546 Bulk Active PGA 365 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0712-T-19

HLS-0712-T-19

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,999
RFQ
HLS-0712-T-19

Datasheet

HLS Bulk Active SIP 87 (7 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
514-83-281-19-081117

514-83-281-19-081117

CONN SOCKET PGA 281POS GOLD

Preci-Dip

2,178
RFQ
514-83-281-19-081117

Datasheet

514 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-83-255M16-001148

514-83-255M16-001148

CONN SOCKET BGA 255POS GOLD

Preci-Dip

4,895
RFQ
514-83-255M16-001148

Datasheet

514 Bulk Active BGA 255 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1338-G-H

APH-1338-G-H

APH-1338-G-H

Samtec Inc.

4,938
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1438-G-H

APH-1438-G-H

APH-1438-G-H

Samtec Inc.

1,009
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0538-G-H

APH-0538-G-H

APH-0538-G-H

Samtec Inc.

1,229
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1938-G-H

APH-1938-G-H

APH-1938-G-H

Samtec Inc.

2,119
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1538-G-H

APH-1538-G-H

APH-1538-G-H

Samtec Inc.

1,909
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0838-G-H

APH-0838-G-H

APH-0838-G-H

Samtec Inc.

2,190
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1638-G-H

APH-1638-G-H

APH-1638-G-H

Samtec Inc.

4,222
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1238-G-H

APH-1238-G-H

APH-1238-G-H

Samtec Inc.

1,543
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0738-G-H

APH-0738-G-H

APH-0738-G-H

Samtec Inc.

2,046
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0238-G-H

APH-0238-G-H

APH-0238-G-H

Samtec Inc.

4,603
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0338-G-H

APH-0338-G-H

APH-0338-G-H

Samtec Inc.

3,876
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0638-G-H

APH-0638-G-H

APH-0638-G-H

Samtec Inc.

4,572
RFQ

-

* - Active - - - - - - - - - - - - - - -
42-6570-11

42-6570-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

2,232
RFQ
42-6570-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6573-11

42-6573-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

4,444
RFQ
42-6573-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
514-83-256M16-000148

514-83-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2,524
RFQ
514-83-256M16-000148

Datasheet

514 Bulk Active BGA 256 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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