IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-43-964-61-003000

116-43-964-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,102
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-964-61-003000

116-93-964-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,839
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
88-PGM13028-10H

88-PGM13028-10H

CONN SOCKET PGA GOLD

Aries Electronics

1,891
RFQ
88-PGM13028-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-87-279-19-081112

614-87-279-19-081112

CONN SOCKET PGA 279POS GOLD

Preci-Dip

4,936
RFQ
614-87-279-19-081112

Datasheet

614 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0528-G-H

APH-0528-G-H

APH-0528-G-H

Samtec Inc.

2,007
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1628-G-H

APH-1628-G-H

APH-1628-G-H

Samtec Inc.

2,231
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1328-G-H

APH-1328-G-H

APH-1328-G-H

Samtec Inc.

4,132
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0228-G-H

APH-0228-G-H

APH-0228-G-H

Samtec Inc.

4,967
RFQ

-

* - Active - - - - - - - - - - - - - - -
1437522-4

1437522-4

CONN SOCKET PGA 321POS GOLD

TE Connectivity AMP Connectors

3,439
RFQ
1437522-4

Datasheet

- Bulk Active PGA 321 (19 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
APH-0534-G-R

APH-0534-G-R

APH-0534-G-R

Samtec Inc.

1,295
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0934-G-R

APH-0934-G-R

APH-0934-G-R

Samtec Inc.

3,161
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1034-G-R

APH-1034-G-R

APH-1034-G-R

Samtec Inc.

2,918
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0734-G-R

APH-0734-G-R

APH-0734-G-R

Samtec Inc.

4,106
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1334-G-R

APH-1334-G-R

APH-1334-G-R

Samtec Inc.

2,779
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0434-G-R

APH-0434-G-R

APH-0434-G-R

Samtec Inc.

4,575
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-43-950-61-008000

116-43-950-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,540
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-950-61-008000

116-93-950-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,973
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-652-61-001000

116-93-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,249
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-87-281-19-001112

614-87-281-19-001112

CONN SOCKET PGA 281POS GOLD

Preci-Dip

4,324
RFQ
614-87-281-19-001112

Datasheet

614 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-83-279-19-081117

514-83-279-19-081117

CONN SOCKET PGA 279POS GOLD

Preci-Dip

2,873
RFQ
514-83-279-19-081117

Datasheet

514 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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