IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
299-99-210-12-001800

299-99-210-12-001800

CONN IC DIP SOCKET 10POS TINLEAD

Mill-Max Manufacturing Corp.

2,346
RFQ
299-99-210-12-001800

Datasheet

299 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-11-314-41-001000

210-11-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,176
RFQ
210-11-314-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-310-31-012000

614-93-310-31-012000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.

1,842
RFQ
614-93-310-31-012000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-310-31-012000

614-43-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,681
RFQ
614-43-310-31-012000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
30-0508-20

30-0508-20

CONN SOCKET SIP 30POS GOLD

Aries Electronics

4,881
RFQ
30-0508-20

Datasheet

508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
114-93-314-41-117000

114-93-314-41-117000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

1,361
RFQ
114-93-314-41-117000

Datasheet

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-241-18-071101

510-83-241-18-071101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

3,162
RFQ
510-83-241-18-071101

Datasheet

510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-241-18-072101

510-83-241-18-072101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

2,727
RFQ
510-83-241-18-072101

Datasheet

510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
104-13-308-41-780000

104-13-308-41-780000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

3,151
RFQ
104-13-308-41-780000

Datasheet

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
64-9513-11

64-9513-11

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

2,573
RFQ
64-9513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
19-0508-21

19-0508-21

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2,413
RFQ
19-0508-21

Datasheet

508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
19-0508-31

19-0508-31

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3,347
RFQ
19-0508-31

Datasheet

508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
614-41-308-41-001000

614-41-308-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,496
RFQ
614-41-308-41-001000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-308-41-001000

614-91-308-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,438
RFQ
614-91-308-41-001000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-44-328-41-003000

115-44-328-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,702
RFQ
115-44-328-41-003000

Datasheet

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-44-628-41-003000

115-44-628-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,198
RFQ
115-44-628-41-003000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-310-31-002000

614-43-310-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,886
RFQ
614-43-310-31-002000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-310-31-002000

614-93-310-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,833
RFQ
614-93-310-31-002000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0217-T-38

HLS-0217-T-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,511
RFQ
HLS-0217-T-38

Datasheet

HLS Tube Active SIP 34 (2 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
111-41-324-41-001000

111-41-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,055
RFQ
111-41-324-41-001000

Datasheet

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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