IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1406-G-H

APH-1406-G-H

APH-1406-G-H

Samtec Inc.

3,680
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1006-G-H

APH-1006-G-H

APH-1006-G-H

Samtec Inc.

2,211
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0906-G-H

APH-0906-G-H

APH-0906-G-H

Samtec Inc.

3,016
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1506-G-H

APH-1506-G-H

APH-1506-G-H

Samtec Inc.

3,447
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0606-G-H

APH-0606-G-H

APH-0606-G-H

Samtec Inc.

3,187
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1106-G-H

APH-1106-G-H

APH-1106-G-H

Samtec Inc.

4,594
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1606-G-H

APH-1606-G-H

APH-1606-G-H

Samtec Inc.

4,412
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1206-G-H

APH-1206-G-H

APH-1206-G-H

Samtec Inc.

3,278
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0406-G-H

APH-0406-G-H

APH-0406-G-H

Samtec Inc.

2,152
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1706-G-H

APH-1706-G-H

APH-1706-G-H

Samtec Inc.

3,930
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1806-G-H

APH-1806-G-H

APH-1806-G-H

Samtec Inc.

4,192
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0706-G-H

APH-0706-G-H

APH-0706-G-H

Samtec Inc.

4,172
RFQ

-

* - Active - - - - - - - - - - - - - - -
HLS-0215-G-10

HLS-0215-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,283
RFQ
HLS-0215-G-10

Datasheet

HLS Tube Active SIP 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
18-6810-90

18-6810-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,900
RFQ
18-6810-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
22-81150-610C

22-81150-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,653
RFQ
22-81150-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-81250-310C

22-81250-310C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,564
RFQ
22-81250-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-81250-610C

22-81250-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,863
RFQ
22-81250-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-8500-610C

22-8500-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,625
RFQ
22-8500-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-8600-610C

22-8600-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,533
RFQ
22-8600-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-8850-610C

22-8850-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,794
RFQ
22-8850-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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