IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
514-87-127-16-091117

514-87-127-16-091117

CONN SOCKET PGA 127POS GOLD

Preci-Dip

1,286
RFQ
514-87-127-16-091117

Datasheet

514 Bulk Active PGA 127 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-11-314-41-001000

110-11-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,527
RFQ
110-11-314-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-322-41-105000

110-41-322-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,776
RFQ
110-41-322-41-105000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-422-41-105000

110-41-422-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,303
RFQ
110-41-422-41-105000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-322-41-105000

110-91-322-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,185
RFQ
110-91-322-41-105000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-422-41-105000

110-91-422-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,017
RFQ
110-91-422-41-105000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
44-PGM08003-10

44-PGM08003-10

CONN SOCKET PGA GOLD

Aries Electronics

1,530
RFQ
44-PGM08003-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICO-624-ZNGG

ICO-624-ZNGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,601
RFQ
ICO-624-ZNGG

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
550-10-069-11-001101

550-10-069-11-001101

PGA SOLDER TAIL

Preci-Dip

3,415
RFQ
550-10-069-11-001101

Datasheet

550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-10-069-11-061101

550-10-069-11-061101

PGA SOLDER TAIL

Preci-Dip

4,272
RFQ
550-10-069-11-061101

Datasheet

550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-91-304-61-001000

110-91-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,114
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-93-110-41-005000

317-93-110-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

4,754
RFQ
317-93-110-41-005000

Datasheet

317 Tube Active SIP 10 (1 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-41-628-41-001000

210-41-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,429
RFQ
210-41-628-41-001000

Datasheet

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-91-628-41-001000

210-91-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,886
RFQ
210-91-628-41-001000

Datasheet

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-308-41-002000

126-41-308-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,141
RFQ
126-41-308-41-002000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-308-41-002000

126-91-308-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,047
RFQ
126-91-308-41-002000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-93-111-41-005000

317-93-111-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

1,813
RFQ
317-93-111-41-005000

Datasheet

317 Bulk Active SIP 11 (1 x 11) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-310-41-001000

116-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,926
RFQ
116-41-310-41-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-310-41-001000

116-91-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,193
RFQ
116-91-310-41-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-232-17-061101

510-83-232-17-061101

CONN SOCKET PGA 232POS GOLD

Preci-Dip

3,185
RFQ
510-83-232-17-061101

Datasheet

510 Bulk Active PGA 232 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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