IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
146-41-314-41-012000

146-41-314-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,883
RFQ
146-41-314-41-012000

Datasheet

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-314-41-012000

146-91-314-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2,744
RFQ
146-91-314-41-012000

Datasheet

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-304-61-001000

116-43-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,073
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-304-61-001000

116-93-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,130
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-308-31-002000

614-41-308-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,432
RFQ
614-41-308-31-002000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-308-31-002000

614-91-308-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,772
RFQ
614-91-308-31-002000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-47-420-41-003000

115-47-420-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

1,564
RFQ
115-47-420-41-003000

Datasheet

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-7445-10

24-7445-10

CONN SOCKET SIP 24POS TIN

Aries Electronics

4,504
RFQ
24-7445-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-7500-10

24-7500-10

CONN SOCKET SIP 24POS TIN

Aries Electronics

4,827
RFQ
24-7500-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-6518-01

32-6518-01

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,623
RFQ
32-6518-01

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
84-PGM10003-10

84-PGM10003-10

CONN SOCKET PGA GOLD

Aries Electronics

4,638
RFQ
84-PGM10003-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
84-PGM11009-10

84-PGM11009-10

CONN SOCKET PGA GOLD

Aries Electronics

1,319
RFQ
84-PGM11009-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
84-PGM11010-10

84-PGM11010-10

CONN SOCKET PGA GOLD

Aries Electronics

3,682
RFQ
84-PGM11010-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
84-PGM13053-10

84-PGM13053-10

CONN SOCKET PGA GOLD

Aries Electronics

1,454
RFQ
84-PGM13053-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-41-308-31-007000

614-41-308-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,222
RFQ
614-41-308-31-007000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-308-31-007000

614-91-308-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,751
RFQ
614-91-308-31-007000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-420-41-001000

110-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,087
RFQ
110-43-420-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-43-318-41-001000

210-43-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,183
RFQ
210-43-318-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-93-318-41-001000

210-93-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,656
RFQ
210-93-318-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
268-5401-52-1102JH

268-5401-52-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

3,729
RFQ
268-5401-52-1102JH

Datasheet

OEM Bulk Obsolete CLCC 68 (4 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER