IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
614-87-085-11-041112

614-87-085-11-041112

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,326
RFQ
614-87-085-11-041112

Datasheet

614 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
317-47-107-41-005000

317-47-107-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

3,609
RFQ
317-47-107-41-005000

Datasheet

317 Bulk Active SIP 7 (1 x 7) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-201-15-041101

510-83-201-15-041101

CONN SOCKET PGA 201POS GOLD

Preci-Dip

3,067
RFQ
510-83-201-15-041101

Datasheet

510 Bulk Active PGA 201 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-41-306-41-013000

146-41-306-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,511
RFQ
146-41-306-41-013000

Datasheet

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-306-41-013000

146-91-306-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,355
RFQ
146-91-306-41-013000

Datasheet

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-310-41-105000

110-47-310-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

1,243
RFQ
110-47-310-41-105000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
26-0508-20

26-0508-20

CONN SOCKET SIP 26POS GOLD

Aries Electronics

3,151
RFQ
26-0508-20

Datasheet

508 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
26-0508-30

26-0508-30

CONN SOCKET SIP 26POS GOLD

Aries Electronics

3,027
RFQ
26-0508-30

Datasheet

508 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
16-0501-21

16-0501-21

CONN SOCKET SIP 16POS GOLD

Aries Electronics

4,682
RFQ
16-0501-21

Datasheet

501 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
16-0501-31

16-0501-31

CONN SOCKET SIP 16POS GOLD

Aries Electronics

1,330
RFQ
16-0501-31

Datasheet

501 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
HLS-0408-S-2

HLS-0408-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,606
RFQ
HLS-0408-S-2

Datasheet

HLS Bulk Active SIP 32 (4 x 8) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
714-43-133-31-018000

714-43-133-31-018000

CONN SOCKET SIP 33POS GOLD

Mill-Max Manufacturing Corp.

1,037
RFQ
714-43-133-31-018000

Datasheet

714 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-306-41-605000

110-41-306-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,371
RFQ
110-41-306-41-605000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-306-41-605000

110-91-306-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,741
RFQ
110-91-306-41-605000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0117-G-12

HLS-0117-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,595
RFQ
HLS-0117-G-12

Datasheet

HLS Tube Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
28-6518-01

28-6518-01

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,750
RFQ
28-6518-01

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-41-306-41-006000

116-41-306-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,966
RFQ
116-41-306-41-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-306-41-006000

116-91-306-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,580
RFQ
116-91-306-41-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-308-41-605000

110-47-308-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,001
RFQ
110-47-308-41-605000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-41-310-41-001000

111-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,268
RFQ
111-41-310-41-001000

Datasheet

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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