IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
18-8560-610C

18-8560-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,980
RFQ
18-8560-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8590-610C

18-8590-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,188
RFQ
18-8590-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8600-610C

18-8600-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,001
RFQ
18-8600-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8640-610C

18-8640-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

1,441
RFQ
18-8640-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8650-610C

18-8650-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,203
RFQ
18-8650-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8670-610C

18-8670-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

1,693
RFQ
18-8670-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8685-610C

18-8685-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,857
RFQ
18-8685-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8700-610C

18-8700-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,206
RFQ
18-8700-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8750-610C

18-8750-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,461
RFQ
18-8750-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8870-610C

18-8870-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

1,687
RFQ
18-8870-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0610-TT-22

HLS-0610-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,052
RFQ
HLS-0610-TT-22

Datasheet

HLS Bulk Active SIP 60 (6 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
20-0501-21

20-0501-21

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,198
RFQ
20-0501-21

Datasheet

501 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
20-0501-31

20-0501-31

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,836
RFQ
20-0501-31

Datasheet

501 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
614-87-084-10-001112

614-87-084-10-001112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

4,585
RFQ
614-87-084-10-001112

Datasheet

614 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-084-10-031112

614-87-084-10-031112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2,420
RFQ
614-87-084-10-031112

Datasheet

614 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
40-6513-11H

40-6513-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,345
RFQ
40-6513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APO-628-T-R

APO-628-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,465
RFQ
APO-628-T-R

Datasheet

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0916-T-H

APH-0916-T-H

APH-0916-T-H

Samtec Inc.

3,289
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0516-T-H

APH-0516-T-H

APH-0516-T-H

Samtec Inc.

4,053
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1516-T-H

APH-1516-T-H

APH-1516-T-H

Samtec Inc.

1,397
RFQ

-

* - Active - - - - - - - - - - - - - - -
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