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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
32-0508-20 CONN SOCKET SIP 32POS GOLD Aries Electronics	3,947	-	RFQ	Datasheet	508	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
32-0508-30 CONN SOCKET SIP 32POS GOLD Aries Electronics	1,314	-	RFQ	Datasheet	508	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
32-1508-20 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	1,728	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
32-1508-30 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3,702	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
210-99-314-41-001000 CONN IC DIP SOCKET 14POS TINLEAD Mill-Max Manufacturing Corp.	4,325	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-44-314-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	1,518	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-47-210-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	1,619	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
114-47-308-41-117000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	2,539	-	RFQ	Datasheet	114	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-41-306-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,838	-	RFQ	Datasheet	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-91-306-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,575	-	RFQ	Datasheet	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
18-71000-10 CONN SOCKET SIP 18POS TIN Aries Electronics	2,360	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	18 (1 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
18-7500-10 CONN SOCKET SIP 18POS TIN Aries Electronics	2,077	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	18 (1 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
18-7625-10 CONN SOCKET SIP 18POS TIN Aries Electronics	2,304	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	18 (1 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
18-7650-10 CONN SOCKET SIP 18POS TIN Aries Electronics	4,291	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	18 (1 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
18-7740-10 CONN SOCKET SIP 18POS TIN Aries Electronics	1,543	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	18 (1 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
210-43-310-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,841	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICA-628-ZWGT .100" SCREW MACHINE DIP SOCKET Samtec Inc.	3,575	-	RFQ	Datasheet	ICA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
116-47-306-41-007000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	3,356	-	RFQ	Datasheet	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
317-91-104-41-005000 CONN SKT SNG Mill-Max Manufacturing Corp.	1,056	-	RFQ	Datasheet	317	Bulk	Active	SIP	4 (1 x 4)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
111-47-210-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	2,210	-	RFQ	Datasheet	111	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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