IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
317-91-107-41-005000

317-91-107-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

1,827
RFQ
317-91-107-41-005000

Datasheet

317 Bulk Active SIP 7 (1 x 7) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
48-6518-10H

48-6518-10H

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

4,534
RFQ
48-6518-10H

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
614-83-068-10-061112

614-83-068-10-061112

CONN SOCKET PGA 68POS GOLD

Preci-Dip

4,189
RFQ
614-83-068-10-061112

Datasheet

614 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-47-210-41-117000

114-47-210-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,341
RFQ
114-47-210-41-117000

Datasheet

114 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-626-10-002000

299-43-626-10-002000

CONN IC DIP SOCKET 26POS GOLD

Mill-Max Manufacturing Corp.

2,140
RFQ
299-43-626-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-306-41-105000

110-47-306-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,680
RFQ
110-47-306-41-105000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-6501-21

24-6501-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,977
RFQ
24-6501-21

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-43-304-61-006000

116-43-304-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,845
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-304-61-006000

116-93-304-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,297
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-632-ZSGG-L

ICA-632-ZSGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,950
RFQ
ICA-632-ZSGG-L

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APH-1816-T-R

APH-1816-T-R

APH-1816-T-R

Samtec Inc.

1,860
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1916-T-R

APH-1916-T-R

APH-1916-T-R

Samtec Inc.

3,449
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1516-T-R

APH-1516-T-R

APH-1516-T-R

Samtec Inc.

2,667
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0216-T-R

APH-0216-T-R

APH-0216-T-R

Samtec Inc.

1,990
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1316-T-R

APH-1316-T-R

APH-1316-T-R

Samtec Inc.

4,947
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1216-T-R

APH-1216-T-R

APH-1216-T-R

Samtec Inc.

1,767
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-43-310-41-001000

110-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,994
RFQ
110-43-310-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-628-ZAGG

ICA-628-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,669
RFQ
ICA-628-ZAGG

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-628-ZAGG

ICO-628-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,362
RFQ
ICO-628-ZAGG

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
36-6513-11H

36-6513-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

1,807
RFQ
36-6513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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