IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0908-T-H

APH-0908-T-H

APH-0908-T-H

Samtec Inc.

4,982
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1408-T-H

APH-1408-T-H

APH-1408-T-H

Samtec Inc.

1,347
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0708-T-H

APH-0708-T-H

APH-0708-T-H

Samtec Inc.

2,790
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1208-T-H

APH-1208-T-H

APH-1208-T-H

Samtec Inc.

4,911
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1808-T-H

APH-1808-T-H

APH-1808-T-H

Samtec Inc.

3,183
RFQ

-

* - Active - - - - - - - - - - - - - - -
28-6518-102

28-6518-102

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,182
RFQ
28-6518-102

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-632-41-013101

116-87-632-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,360
RFQ
116-87-632-41-013101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-322-CGT

ICO-322-CGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,258
RFQ
ICO-322-CGT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
28-6501-20

28-6501-20

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

3,207
RFQ
28-6501-20

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-71187-10

06-71187-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

4,265
RFQ
06-71187-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-7360-10

06-7360-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

2,702
RFQ
06-7360-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-7425-10

06-7425-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

3,718
RFQ
06-7425-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-7755-10

06-7755-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

1,484
RFQ
06-7755-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
64-9513-10T

64-9513-10T

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3,264
RFQ
64-9513-10T

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-632-WTT-3

ICA-632-WTT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,871
RFQ
ICA-632-WTT-3

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
346-93-127-41-013000

346-93-127-41-013000

CONN SOCKET SIP 27POS GOLD

Mill-Max Manufacturing Corp.

3,562
RFQ
346-93-127-41-013000

Datasheet

346 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-127-41-013000

346-43-127-41-013000

CONN SOCKET SIP 27POS GOLD

Mill-Max Manufacturing Corp.

4,198
RFQ
346-43-127-41-013000

Datasheet

346 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-324-WGT-3

ICA-324-WGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,306
RFQ
ICA-324-WGT-3

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
14-6511-11

14-6511-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

4,936
RFQ
14-6511-11

Datasheet

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
ICA-314-JGG

ICA-314-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,762
RFQ
ICA-314-JGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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