IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
126-43-304-41-002000

126-43-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,453
RFQ
126-43-304-41-002000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-87-225-17-001101

510-87-225-17-001101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2,391
RFQ
510-87-225-17-001101

Datasheet

510 Bulk Active PGA 225 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-C182-11

28-C182-11

DIP SOCKET

Aries Electronics

4,598
RFQ

-

EJECT-A-DIP™ - Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
37-0511-10

37-0511-10

CONN SOCKET SIP 37POS TIN

Aries Electronics

2,816
RFQ
37-0511-10

Datasheet

511 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-3513-10H

26-3513-10H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,287
RFQ
26-3513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-C212-11

28-C212-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,987
RFQ
28-C212-11

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
28-C300-11

28-C300-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,075
RFQ
28-C300-11

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
299-43-318-10-001000

299-43-318-10-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2,415
RFQ
299-43-318-10-001000

Datasheet

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
12-0501-21

12-0501-21

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,852
RFQ
12-0501-21

Datasheet

501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
12-0501-31

12-0501-31

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,014
RFQ
12-0501-31

Datasheet

501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APO-318-T-R

APO-318-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,513
RFQ
APO-318-T-R

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-1510-T-R

APH-1510-T-R

APH-1510-T-R

Samtec Inc.

3,527
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1910-T-R

APH-1910-T-R

APH-1910-T-R

Samtec Inc.

3,093
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0610-T-R

APH-0610-T-R

APH-0610-T-R

Samtec Inc.

3,888
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1110-T-R

APH-1110-T-R

APH-1110-T-R

Samtec Inc.

1,158
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0910-T-R

APH-0910-T-R

APH-0910-T-R

Samtec Inc.

1,127
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0410-T-R

APH-0410-T-R

APH-0410-T-R

Samtec Inc.

1,164
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1710-T-R

APH-1710-T-R

APH-1710-T-R

Samtec Inc.

1,436
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1410-T-R

APH-1410-T-R

APH-1410-T-R

Samtec Inc.

2,691
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1610-T-R

APH-1610-T-R

APH-1610-T-R

Samtec Inc.

4,145
RFQ

-

* - Active - - - - - - - - - - - - - - -
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