IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-83-428-41-013101

116-83-428-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,972
RFQ
116-83-428-41-013101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-648-41-008101

116-83-648-41-008101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,753
RFQ
116-83-648-41-008101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
39-0511-10

39-0511-10

CONN SOCKET SIP 39POS TIN

Aries Electronics

4,850
RFQ
39-0511-10

Datasheet

511 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-820-90TWR

16-820-90TWR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3,991
RFQ
16-820-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
16-822-90TWR

16-822-90TWR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

4,407
RFQ
16-822-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
16-823-90TWR

16-823-90TWR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

1,061
RFQ
16-823-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
APO-320-T-T

APO-320-T-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,085
RFQ
APO-320-T-T

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
510-83-121-15-001101

510-83-121-15-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

3,242
RFQ
510-83-121-15-001101

Datasheet

510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-121-15-061101

510-83-121-15-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

1,955
RFQ
510-83-121-15-061101

Datasheet

510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-648-41-001101

116-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,050
RFQ
116-83-648-41-001101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0311-T-2

HLS-0311-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,387
RFQ
HLS-0311-T-2

Datasheet

HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0212-T-22

HLS-0212-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,784
RFQ
HLS-0212-T-22

Datasheet

HLS Tube Active SIP 24 (2 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
18-6503-20

18-6503-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,758
RFQ
18-6503-20

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-6503-30

18-6503-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,440
RFQ
18-6503-30

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0314-TT-11

HLS-0314-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,925
RFQ
HLS-0314-TT-11

Datasheet

HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
ICA-628-KGT

ICA-628-KGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,305
RFQ
ICA-628-KGT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
299-87-628-10-002101

299-87-628-10-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,750
RFQ
299-87-628-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
35-0518-11H

35-0518-11H

CONN SOCKET SIP 35POS GOLD

Aries Electronics

3,835
RFQ
35-0518-11H

Datasheet

518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
40-0518-11H

40-0518-11H

CONN SOCKET SIP 40POS GOLD

Aries Electronics

3,925
RFQ
40-0518-11H

Datasheet

518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
AR64-HZW/T-R

AR64-HZW/T-R

CONN IC DIP SOCKET 64POS GOLD

Assmann WSW Components

3,120
RFQ
AR64-HZW/T-R

Datasheet

- Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
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