IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0810-T-R

APH-0810-T-R

APH-0810-T-R

Samtec Inc.

3,654
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1310-T-R

APH-1310-T-R

APH-1310-T-R

Samtec Inc.

4,835
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1810-T-R

APH-1810-T-R

APH-1810-T-R

Samtec Inc.

4,216
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0710-T-R

APH-0710-T-R

APH-0710-T-R

Samtec Inc.

1,572
RFQ

-

* - Active - - - - - - - - - - - - - - -
614-83-044-08-031112

614-83-044-08-031112

CONN SOCKET PGA 44POS GOLD

Preci-Dip

2,215
RFQ
614-83-044-08-031112

Datasheet

614 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
104-11-304-41-780000

104-11-304-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,360
RFQ
104-11-304-41-780000

Datasheet

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-41-304-11-480000

605-41-304-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,154
RFQ
605-41-304-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-91-304-11-480000

605-91-304-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,692
RFQ
605-91-304-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
5-1437535-4

5-1437535-4

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors

2,997
RFQ

-

500 Tube Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper - -
34-0518-11H

34-0518-11H

CONN SOCKET SIP 34POS GOLD

Aries Electronics

1,909
RFQ
34-0518-11H

Datasheet

518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
34-1518-11H

34-1518-11H

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3,555
RFQ
34-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-6820-90TWR

20-6820-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3,048
RFQ
20-6820-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
116-87-628-41-013101

116-87-628-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,578
RFQ
116-87-628-41-013101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-133-13-002101

510-83-133-13-002101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

3,745
RFQ
510-83-133-13-002101

Datasheet

510 Bulk Active PGA 133 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-133-13-041101

510-83-133-13-041101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

2,992
RFQ
510-83-133-13-041101

Datasheet

510 Bulk Active PGA 133 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
24-3518-10E

24-3518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,724
RFQ
24-3518-10E

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-224-18-091101

510-87-224-18-091101

CONN SOCKET PGA 224POS GOLD

Preci-Dip

3,647
RFQ
510-87-224-18-091101

Datasheet

510 Bulk Active PGA 224 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
11-0503-21

11-0503-21

CONN SOCKET SIP 11POS GOLD

Aries Electronics

1,062
RFQ
11-0503-21

Datasheet

0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
11-0503-31

11-0503-31

CONN SOCKET SIP 11POS GOLD

Aries Electronics

1,369
RFQ
11-0503-31

Datasheet

0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
39-0518-00

39-0518-00

CONN SOCKET SIP 39POS GOLD

Aries Electronics

2,658
RFQ
39-0518-00

Datasheet

518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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