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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
214-99-640-01-670800 CONN IC DIP SOCKET 40POS TINLEAD Mill-Max Manufacturing Corp.	154	-	RFQ	Datasheet	214	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
111-93-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	196	-	RFQ	Datasheet	111	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICF-308-S-O CONN IC DIP SOCKET 8POS TIN Samtec Inc.	4,782	-	RFQ	Datasheet	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
115-93-632-41-003000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	121	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
08-2503-30 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	121	-	RFQ	Datasheet	503	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
115-93-632-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	806	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
111-43-632-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	170	-	RFQ	Datasheet	111	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-308-11-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	136	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-93-320-31-012000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	381	-	RFQ	Datasheet	614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-43-320-31-012000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	159	-	RFQ	Datasheet	614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICA-320-SGG CONN IC DIP SOCKET 20POS GOLD Samtec Inc.	2,028	-	RFQ	Datasheet	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
614-93-628-31-012000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	1,518	-	RFQ	Datasheet	614	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-950-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	207	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-93-314-41-801000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	137	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-324-41-801000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	209	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-610-10-002000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	102	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
317-43-121-41-005000 CONN SOCKET 21POS .070 STR GOLD Mill-Max Manufacturing Corp.	339	-	RFQ	Datasheet	317	Tube	Active	SIP	21 (1 x 21)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-618-10-002000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	107	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICF-632-S-O-TR CONN IC DIP SOCKET 32POS TIN Samtec Inc.	271	-	RFQ	Datasheet	ICF	Tape & Reel (TR)	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
2319757-1 DUAL LGA,257 POS, DMD SOCKET TE Connectivity AMP Connectors	1,140	-	RFQ	Datasheet	DMD	Tray	Active	LGA	257 (20 x 30)	0.039" (1.00mm)	Gold	3.00µin (0.076µm)	Copper Alloy	Surface Mount	Board Guide, Open Frame	Solder	-	-	-	-	Thermoplastic	-25°C ~ 100°C

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