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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
110-93-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	125	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICF-640-S-O CONN IC DIP SOCKET 40POS TIN Samtec Inc.	539	-	RFQ	Datasheet	ICF	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
14-823-90 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	149	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
614-93-640-31-012000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	147	-	RFQ	Datasheet	614	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-43-640-41-001000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	229	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APA-628-G-A1 ADAPTER PLUG Samtec Inc.	140	-	RFQ	Datasheet	APA	Bulk	Active	-	28 (2 x 14)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
940-44-028-24-000000 CONN SOCKET PLCC 28POS TIN Mill-Max Manufacturing Corp.	1,185	-	RFQ	Datasheet	940	Tube	Active	PLCC	28 (4 x 7)	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
10-810-90C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	115	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
40-C212-10 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	700	-	RFQ	Datasheet	EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
12-810-90C CONN IC DIP SOCKET 12POS GOLD Aries Electronics	529	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
ICA-640-SGG CONN IC DIP SOCKET 40POS GOLD Samtec Inc.	2,361	-	RFQ	Datasheet	ICA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
346-93-164-41-013000 CONN SOCKET SIP 64POS GOLD Mill-Max Manufacturing Corp.	170	-	RFQ	Datasheet	346	Tube	Active	SIP	64 (1 x 64)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APA-628-G-N ADAPTER PLUG Samtec Inc.	230	-	RFQ	Datasheet	APA	Tube	Active	-	28 (2 x 14)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
20-823-90 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	802	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
2350616-1 DUAL LGA,250 POS, DMD SOCKET TE Connectivity AMP Connectors	296	-	RFQ	Datasheet	-	Tray	Active	LGA	250 (16 x 25)	0.039" (1.00mm)	Gold	3.00µin (0.076µm)	Copper Alloy	Surface Mount	Board Guide, Open Frame	Solder	-	-	-	-	Thermoplastic	-25°C ~ 100°C
299-43-308-11-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	704	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
40-6823-90 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	246	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
1-2324271-4 LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors	121	-	RFQ	Datasheet	-	Tray	Active	LGA 4189	2092	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034" (0.86mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
2-2129710-5 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	171	-	RFQ	Datasheet	-	Tray	Last Time Buy	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic	-
2-2129710-6 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	249	-	RFQ	Datasheet	-	Tray	Last Time Buy	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic	-

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