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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
264-1300-00-0602J CONN IC DIP SOCKET ZIF 64POS GLD 3M	169	-	RFQ	Datasheet	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
24-6554-16 CONN IC DIP SOCKET ZIF 24POS Aries Electronics	3,580	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
2-2822979-3 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	168	-	RFQ	Datasheet	-	Tray	Last Time Buy	LGA	3647	0.039" (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034" (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic	-
214-99-308-01-670800 CONN IC DIP SOCKET 8POS TIN-LEAD Mill-Max Manufacturing Corp.	1,068	-	RFQ	Datasheet	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
114-87-310-41-134191 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	2,944	-	RFQ	Datasheet	114	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-47-210-41-006000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	2,142	-	RFQ	Datasheet	116	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
317-47-108-41-005000 CONN SOCKET SIP 8POS GOLD Mill-Max Manufacturing Corp.	470	-	RFQ	Datasheet	317	Tube	Active	SIP	8 (1 x 8)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICF-308-T-O CONN IC DIP SOCKET 8POS TIN Samtec Inc.	4,586	-	RFQ	Datasheet	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
XR2A-0815 CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div	118	-	RFQ	Datasheet	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
110-47-422-41-001000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	225	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 14-HZL/07-TT CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	2,942	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
115-47-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	440	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-1-28-006 CONN IC DIP SOCKET 28POS GOLD CNC Tech	1,264	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
214-99-314-01-670800 CONN IC DIP SOCKET 14POS TINLEAD Mill-Max Manufacturing Corp.	356	-	RFQ	Datasheet	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-93-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	282	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
940-44-020-24-000000 CONN SOCKET PLCC 20POS TIN Mill-Max Manufacturing Corp.	105	-	RFQ	Datasheet	940	Tube	Active	PLCC	20 (4 x 5)	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-47-314-41-006000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	570	-	RFQ	Datasheet	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-47-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	345	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-47-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	308	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-93-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	332	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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