IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
D3920-42

D3920-42

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

1,969
RFQ
D3920-42

Datasheet

D39 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D3924-42

D3924-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

4,769
RFQ
D3924-42

Datasheet

D39 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D73064-42

D73064-42

CONN IC DIP SOCKET 64POS GOLD

Harwin Inc.

4,937
RFQ
D73064-42

Datasheet

D73064 Tube Obsolete DIP, Staggered 64 (2 x 32) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D83028C-46

D83028C-46

CONN SOCKET PLCC 28POS TIN

Harwin Inc.

1,382
RFQ
D83028C-46

Datasheet

D830 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -50°C ~ 105°C
D83044C-46

D83044C-46

CONN SOCKET PLCC 44POS TIN

Harwin Inc.

3,097
RFQ
D83044C-46

Datasheet

D830 Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -50°C ~ 105°C
D83068C-46

D83068C-46

CONN SOCKET PLCC 68POS TIN

Harwin Inc.

2,338
RFQ
D83068C-46

Datasheet

D830 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -50°C ~ 105°C
34-6511-10

34-6511-10

CONN IC DIP SOCKET 34POS TIN

Aries Electronics

1,403
RFQ
34-6511-10

Datasheet

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-6511-11

34-6511-11

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3,000
RFQ
34-6511-11

Datasheet

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
02-0501-30

02-0501-30

CONN SOCKET SIP 2POS TIN

Aries Electronics

1,791
RFQ
02-0501-30

Datasheet

501 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
03-0501-21

03-0501-21

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,956
RFQ
03-0501-21

Datasheet

501 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
07-7XXXX-10

07-7XXXX-10

CONN SOCKET SIP 7POS TIN

Aries Electronics

4,406
RFQ
07-7XXXX-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-7XXXX-10

12-7XXXX-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

4,163
RFQ
12-7XXXX-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-7XXXX-10

20-7XXXX-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

2,597
RFQ
20-7XXXX-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
25-7XXXX-10

25-7XXXX-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,499
RFQ
25-7XXXX-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
33-7XXXX-10

33-7XXXX-10

CONN SOCKET SIP 33POS TIN

Aries Electronics

4,703
RFQ
33-7XXXX-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
35-7XXXX-10

35-7XXXX-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

4,018
RFQ
35-7XXXX-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
1109011

1109011

SERIES 513 LO-PRO W/SOLDER TAIL

Aries Electronics

4,981
RFQ
1109011

Datasheet

- - Active - - - - - - - - - - - - - - -
4236-118-14

4236-118-14

518 OPN FRM COLLET SCKT SLDR TAI

Aries Electronics

3,854
RFQ
4236-118-14

Datasheet

- - Active - - - - - - - - - - - - - - -
2357-108-12

2357-108-12

EJECT-A-DP LCK/EJCT SCKT SLDR TL

Aries Electronics

3,327
RFQ
2357-108-12

Datasheet

- - Active - - - - - - - - - - - - - - -
34-6823-90

34-6823-90

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

4,071
RFQ
34-6823-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
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