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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-382468-4CONN IC DIP SOCKET 40POS GOLD |
2,915 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Phosphor Bronze | Thermoplastic | -55°C ~ 125°C |
|
2-382712-1CONN IC DIP SOCKET 16POS TIN |
4,999 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
8080-1G7CONN TRANSIST TO-3 4POS GOLD |
3,251 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) | -55°C ~ 125°C |
|
822064-5CONN SOCKET PQFP 132POS TIN-LEAD |
4,256 |
|
Datasheet |
- | Tube | Active | QFP | 132 (4 x 33) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
1814655-7CONN SOCKET SIP 10POS GOLD |
2,529 |
|
Datasheet |
- | Bulk | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
|
2-382719-1CONN IC DIP SOCKET 30POS TIN |
2,876 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
1051420132CONN SOCKET LGA 2011POS GOLD |
1,796 |
|
Datasheet |
105142 | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Thermoplastic | - |
|
|
ICO-314-M-TTCONN IC DIP SOCKET 14POS TIN |
3,352 |
|
Datasheet |
ICO | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
|
234-3034-51-0602CONN ZIG-ZAG ZIF 34POS GOLD |
2,371 |
|
- |
Textool™ | Bulk | Discontinued at Digi-Key | Zig-Zag, ZIF (ZIP) | 34 (2 x 17) | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
D01-9500442CONN SOCKET SIP 4POS GOLD |
4,801 |
|
Datasheet |
D01-950 | Bulk | Obsolete | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9500542CONN SOCKET SIP 5POS GOLD |
3,891 |
|
Datasheet |
D01-950 | Tube | Obsolete | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9500642CONN SOCKET SIP 6POS GOLD |
4,051 |
|
Datasheet |
D01-950 | Tube | Obsolete | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9500742CONN SOCKET SIP 7POS GOLD |
3,585 |
|
Datasheet |
D01-950 | Bulk | Obsolete | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9500842CONN SOCKET SIP 8POS GOLD |
4,770 |
|
Datasheet |
D01-950 | Tube | Obsolete | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9500942CONN SOCKET SIP 9POS GOLD |
4,096 |
|
Datasheet |
D01-950 | Tube | Obsolete | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9501042CONN SOCKET SIP 10POS GOLD |
1,171 |
|
Datasheet |
D01-950 | Tube | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9501242CONN SOCKET SIP 12POS GOLD |
4,567 |
|
Datasheet |
D01-950 | Bulk | Obsolete | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9501442CONN SOCKET SIP 14POS GOLD |
2,321 |
|
Datasheet |
D01-950 | Tube | Obsolete | SIP | 14 (1 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9501642CONN SOCKET SIP 16POS GOLD |
4,907 |
|
Datasheet |
D01-950 | Tube | Obsolete | SIP | 16 (1 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
D01-9501842CONN SOCKET SIP 18POS GOLD |
4,572 |
|
Datasheet |
D01-950 | Bulk | Obsolete | SIP | 18 (1 x 18) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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