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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
PLCC-044-T-N CONN SOCKET PLCC 44POS TIN Samtec Inc.	3,448	-	RFQ	Datasheet	PLCC	Tube	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	-	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
PLCC-084-T-N CONN SOCKET PLCC 84POS TIN Samtec Inc.	4,428	-	RFQ	Datasheet	PLCC	Tube	Obsolete	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	-	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
IC-628-SGG CONN IC DIP SOCKET 28POS GOLD Samtec Inc.	2,796	-	RFQ	Datasheet	IC	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Phosphor Bronze	Polyester, Glass Filled	-55°C ~ 125°C
ICO-314-SST-L CONN IC DIP SOCKET 14POS GOLD Samtec Inc.	3,697	-	RFQ	Datasheet	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
0475939000 CONN SOCKET LGA 1366POS NICKEL Molex	1,096	-	RFQ	Datasheet	47594	Tray	Obsolete	LGA	1366 (32 x 41)	-	Nickel	3.00µin (0.076µm)	-	Surface Mount	Closed Frame	Solder	-	Nickel	3.00µin (0.076µm)	-	-	-
CUSTOM BGA CONN SOCKET BGA CUSTOM 3M	1,392	-	RFQ	Datasheet	Textool™	-	Active	BGA	Custom	0.026" ~ 0.050" (0.65mm ~ 1.27mm)	Custom	Custom	-	Through Hole	Custom	-	-	-	-	-	-	-
1939416-1 CONN SOCKET LGA 1207POS GOLD TE Connectivity AMP Connectors	2,670	-	RFQ	Datasheet	-	Tray	Active	LGA	1207 (33 x 34)	0.043" (1.09mm)	Gold	-	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.043" (1.09mm)	-	-	-	Thermoplastic	-55°C ~ 110°C
516-AG7D CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors	4,174	-	RFQ	-	500	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Copper Alloy	Polyester	-55°C ~ 125°C
1939416-2 CONN SOCKET LGA 1207POS GOLD TE Connectivity AMP Connectors	3,860	-	RFQ	Datasheet	-	Tray	Active	LGA	1207 (33 x 34)	0.043" (1.09mm)	Gold	-	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.043" (1.09mm)	-	-	-	Thermoplastic	-55°C ~ 110°C
2-641262-4 CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors	1,781	-	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 125°C
1-1437538-3 CONN IC DIP SOCKET 28POS TINLEAD TE Connectivity AMP Connectors	4,327	-	RFQ	Datasheet	800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
1554116-2 CONN SOCKET LGA 1356POS GOLD TE Connectivity AMP Connectors	3,289	-	RFQ	Datasheet	-	Tray	Obsolete	LGA	1356 (32 x 41)	0.040" (1.02mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.040" (1.01mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
1554116-3 CONN SOCKET LGA 1356POS GOLD TE Connectivity AMP Connectors	2,464	-	RFQ	Datasheet	-	Tray	Obsolete	LGA	1356 (32 x 41)	0.040" (1.02mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.040" (1.01mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
1761122-1 POWER ASSY TE Connectivity AMP Connectors	1,456	-	RFQ	Datasheet	-	Bulk	Active	LGA	145	0.050" (1.27mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic, Glass Filled	-
1939737-1 CONN SOCKET LGA 1366POS TE Connectivity AMP Connectors	2,886	-	RFQ	-	-	Tray	Obsolete	LGA	1366 (32 x 41)	-	-	-	-	-	-	-	-	-	-	-	-	-
8059-2G2 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors	1,063	-	RFQ	Datasheet	8059	Bulk	Obsolete	Transistor, TO-5	3 (Round)	-	Gold	-	Copper Alloy	Through Hole	-	Solder	-	Gold	-	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 125°C
5-1437530-2 CONN IC SIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	3,660	-	RFQ	Datasheet	500	Tube	Obsolete	SIP	8 (1 x 8)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	-	Brass	Polyester	-55°C ~ 125°C
528-AG11D CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	2,110	-	RFQ	Datasheet	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
808-AG12D CONN IC DIP SOCKET 8POS TIN-LEAD TE Connectivity AMP Connectors	2,571	-	RFQ	Datasheet	800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
506-AG11D-ES CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors	1,526	-	RFQ	-	500	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C

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