IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-3575-18

24-3575-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

4,662
RFQ
24-3575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6575-18

24-6575-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

1,468
RFQ
24-6575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
518-77-576M30-001106

518-77-576M30-001106

CONN SOCKET PGA 576POS GOLD

Preci-Dip

4,354
RFQ
518-77-576M30-001106

Datasheet

518 Bulk Active PGA 576 (30 x 30) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
144-PLS15026-12

144-PLS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,368
RFQ
144-PLS15026-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
144-PRS15026-12

144-PRS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,776
RFQ
144-PRS15026-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15058-12

145-PRS15058-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,776
RFQ
145-PRS15058-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15062-12

145-PRS15062-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,552
RFQ
145-PRS15062-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PLS15024-12

145-PLS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,435
RFQ
145-PLS15024-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15024-12

145-PRS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,520
RFQ
145-PRS15024-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
132-PRS14033-12

132-PRS14033-12

PGA ZIF TEST/BURN-IN SOCKET

Aries Electronics

2,294
RFQ

-

PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
268-6311-9UA-1902 GRID ZIP (11X11)

268-6311-9UA-1902 GRID ZIP (11X11)

TEXTOOL 268-6311-9UA-1902 PGA 11

3M

4,911
RFQ

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
HLS-1313-G-18

HLS-1313-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,673
RFQ
HLS-1313-G-18

Datasheet

HLS Bulk Active SIP 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
558-10-600M35-001104

558-10-600M35-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3,632
RFQ
558-10-600M35-001104

Datasheet

558 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-600M35-001105

518-77-600M35-001105

CONN SOCKET PGA 600POS GOLD

Preci-Dip

3,140
RFQ
518-77-600M35-001105

Datasheet

518 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
32-6551-18

32-6551-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,808
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
163-PRS15065-12

163-PRS15065-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,619
RFQ
163-PRS15065-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PLS17012-12

169-PLS17012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,670
RFQ
169-PLS17012-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PRS17012-12

169-PRS17012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,496
RFQ
169-PRS17012-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PRS17053-12

169-PRS17053-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,471
RFQ
169-PRS17053-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-600M35-001106

518-77-600M35-001106

CONN SOCKET PGA 600POS GOLD

Preci-Dip

4,868
RFQ
518-77-600M35-001106

Datasheet

518 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
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