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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
28-3552-18CONN IC DIP SOCKET ZIF 28POS |
1,065 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
|
|
28-3553-18CONN IC DIP SOCKET ZIF 28POS |
1,042 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
|
|
28-6551-18CONN IC DIP SOCKET ZIF 28POS |
1,016 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
|
|
28-6552-18CONN IC DIP SOCKET ZIF 28POS |
4,957 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
|
|
28-6553-18CONN IC DIP SOCKET ZIF 32POS TIN |
4,736 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
28-3554-18CONN IC DIP SOCKET ZIF 24POS |
3,808 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
|
|
7100148803TEXTOOL1012-0-0289-0B-00L20 0.65 |
3,832 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
192-PRS17027-12CONN SOCKET PGA ZIF GOLD |
2,737 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
7010402522TEXTOOLTEST & BURN-IN SOCKETS PL |
1,189 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
244-5205-003M TEXTOOL OPEN-TOP SOCKETS FOR |
4,734 |
|
- |
Textool™ | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
216-PRS21016-12CONN SOCKET PGA ZIF GOLD |
3,102 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
208-PLS17017-12CONN SOCKET PGA ZIF GOLD |
4,312 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
32-3574-18CONN IC DIP SOCKET ZIF 32POS |
3,253 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
32-6574-18CONN IC DIP SOCKET ZIF 32POS TIN |
2,329 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
209-PRS17030-12CONN SOCKET PGA ZIF GOLD |
4,889 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
209-PRS17046-12CONN SOCKET PGA ZIF GOLD |
4,456 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
176-PRS15014-12CONN SOCKET PGA ZIF GOLD |
2,615 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
280-PLS19006-12CONN SOCKET PGA ZIF GOLD |
2,707 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
280-PRS19006-12CONN SOCKET PGA ZIF GOLD |
4,690 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
281-PRS19012-12CONN SOCKET PGA ZIF GOLD |
2,330 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
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