IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
44-6570-16

44-6570-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

1,077
RFQ
44-6570-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
518-77-520M31-001105

518-77-520M31-001105

CONN SOCKET PGA 520POS GOLD

Preci-Dip

4,909
RFQ
518-77-520M31-001105

Datasheet

518 Bulk Active PGA 520 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
120-PLS13015-12

120-PLS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,315
RFQ
120-PLS13015-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
120-PRS13015-12

120-PRS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,850
RFQ
120-PRS13015-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
24-3551-18

24-3551-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3,305
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
47-PLS16021-12

47-PLS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,975
RFQ
47-PLS16021-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
47-PRS16021-12

47-PRS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,960
RFQ
47-PRS16021-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
76-PLS19033-12

76-PLS19033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,875
RFQ
76-PLS19033-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
76-PRS19033-12

76-PRS19033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,495
RFQ
76-PRS19033-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PLS13013-12

121-PLS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,853
RFQ
121-PLS13013-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PLS13106-12

121-PLS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,781
RFQ
121-PLS13106-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PRS13013-12

121-PRS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,344
RFQ
121-PRS13013-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PRS13106-12

121-PRS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,379
RFQ
121-PRS13106-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
510-13-400-20-000001

510-13-400-20-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,862
RFQ
510-13-400-20-000001

Datasheet

510 Bulk Active PGA 400 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-PLS13009-12

124-PLS13009-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,175
RFQ
124-PLS13009-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
124-PRS13009-12

124-PRS13009-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,287
RFQ
124-PRS13009-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
112-PRS21028-12

112-PRS21028-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,912
RFQ
112-PRS21028-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
144-PLS12001-12

144-PLS12001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,699
RFQ
144-PLS12001-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
144-PRS12001-12

144-PRS12001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,758
RFQ
144-PRS12001-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
558-10-560M33-001101

558-10-560M33-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2,696
RFQ
558-10-560M33-001101

Datasheet

558 Bulk Active PGA 560 (33 x 33) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
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