IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0638-T-R

APH-0638-T-R

APH-0638-T-R

Samtec Inc.

4,964
RFQ

-

* - Active - - - - - - - - - - - - - - -
546-87-179-18-111135

546-87-179-18-111135

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3,103
RFQ
546-87-179-18-111135

Datasheet

546 Bulk Active PGA 179 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-179-18-111136

546-87-179-18-111136

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3,624
RFQ
546-87-179-18-111136

Datasheet

546 Bulk Active PGA 179 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
605-41-642-11-480000

605-41-642-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,812
RFQ
605-41-642-11-480000

Datasheet

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-91-642-11-480000

605-91-642-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,187
RFQ
605-91-642-11-480000

Datasheet

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
410-93-264-41-001000

410-93-264-41-001000

SOCKET DUAL IN-LINE SLDRTL 64POS

Mill-Max Manufacturing Corp.

3,499
RFQ
410-93-264-41-001000

Datasheet

410 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-648-41-007000

116-41-648-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,934
RFQ
116-41-648-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-47-652-41-007000

116-47-652-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,176
RFQ
116-47-652-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-648-41-007000

116-91-648-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,076
RFQ
116-91-648-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-91-640-41-001000

123-91-640-41-001000

SOCKET IC OPEN 3 LVL .600 40POS

Mill-Max Manufacturing Corp.

3,855
RFQ

-

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-640-41-001000

123-41-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,048
RFQ
123-41-640-41-001000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-91-068-10-041001

510-91-068-10-041001

SOCKET SOLDERTAIL 68-PGA

Mill-Max Manufacturing Corp.

3,675
RFQ
510-91-068-10-041001

Datasheet

510 Tube Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-328-41-003000

126-41-328-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,233
RFQ
126-41-328-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-428-41-003000

126-41-428-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,137
RFQ
126-41-428-41-003000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-628-41-003000

126-41-628-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,989
RFQ
126-41-628-41-003000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-328-41-003000

126-91-328-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,535
RFQ
126-91-328-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-428-41-003000

126-91-428-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,708
RFQ
126-91-428-41-003000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-628-41-003000

126-91-628-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,934
RFQ
126-91-628-41-003000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-950-41-006000

116-41-950-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,549
RFQ
116-41-950-41-006000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-950-41-006000

116-91-950-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,944
RFQ
116-91-950-41-006000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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