IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
614-41-636-41-001000

614-41-636-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,215
RFQ
614-41-636-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-636-41-001000

614-91-636-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,417
RFQ
614-91-636-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-87-372-19-111111

517-87-372-19-111111

CONN SOCKET PGA 372POS GOLD

Preci-Dip

3,441
RFQ
517-87-372-19-111111

Datasheet

517 Bulk Active PGA 372 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-632-ZWGG-2

ICA-632-ZWGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,955
RFQ
ICA-632-ZWGG-2

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
614-87-144-15-081112

614-87-144-15-081112

CONN SOCKET PGA 144POS GOLD

Preci-Dip

1,451
RFQ
614-87-144-15-081112

Datasheet

614 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-648-G-J

APA-648-G-J

ADAPTER PLUG

Samtec Inc.

3,389
RFQ
APA-648-G-J

Datasheet

APA Tube Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
116-47-636-41-001000

116-47-636-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,594
RFQ
116-47-636-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-83-133-14-002136

546-83-133-14-002136

CONN SOCKET PGA 133POS GOLD

Preci-Dip

2,801
RFQ
546-83-133-14-002136

Datasheet

546 Bulk Active PGA 133 (14 x 14) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-640-WGG-2

ICA-640-WGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,227
RFQ
ICA-640-WGG-2

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
22-4503-21

22-4503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,729
RFQ
22-4503-21

Datasheet

503 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-0508-21

24-0508-21

CONN SOCKET SIP 24POS GOLD

Aries Electronics

4,968
RFQ
24-0508-21

Datasheet

508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
24-1508-21

24-1508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,653
RFQ
24-1508-21

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
714-43-159-31-018000

714-43-159-31-018000

CONN SOCKET SIP 59POS GOLD

Mill-Max Manufacturing Corp.

1,361
RFQ
714-43-159-31-018000

Datasheet

714 Bulk Active SIP 59 (1 x 59) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
34-81150-610C

34-81150-610C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

1,846
RFQ
34-81150-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-81250-610C

34-81250-610C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

4,146
RFQ
34-81250-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-41-642-31-012000

614-41-642-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,193
RFQ
614-41-642-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-642-31-012000

614-91-642-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,527
RFQ
614-91-642-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
316-93-132-41-008000

316-93-132-41-008000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

4,056
RFQ
316-93-132-41-008000

Datasheet

316 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-80-149-15-063101

550-80-149-15-063101

PGA SOLDER TAIL

Preci-Dip

2,699
RFQ
550-80-149-15-063101

Datasheet

550 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
323-93-132-41-001000

323-93-132-41-001000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

4,329
RFQ
323-93-132-41-001000

Datasheet

323 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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