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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
33-0501-21 CONN SOCKET SIP 33POS GOLD Aries Electronics	2,183	-	RFQ	Datasheet	501	Bulk	Active	SIP	33 (1 x 33)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
35-0501-20 CONN SOCKET SIP 35POS TIN Aries Electronics	3,404	-	RFQ	Datasheet	501	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
35-0501-30 CONN SOCKET SIP 35POS TIN Aries Electronics	1,472	-	RFQ	Datasheet	501	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
614-91-640-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	4,146	-	RFQ	Datasheet	614	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
122-13-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	3,318	-	RFQ	Datasheet	122	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
122-13-424-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	3,150	-	RFQ	Datasheet	122	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
122-13-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	4,798	-	RFQ	Datasheet	122	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APH-0928-T-R APH-0928-T-R Samtec Inc.	1,541	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0728-T-R APH-0728-T-R Samtec Inc.	4,311	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1228-T-R APH-1228-T-R Samtec Inc.	3,934	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0228-T-R APH-0228-T-R Samtec Inc.	1,734	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1628-T-R APH-1628-T-R Samtec Inc.	3,872	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
44-6556-30 CONN IC DIP SOCKET 44POS GOLD Aries Electronics	1,157	-	RFQ	Datasheet	6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
44-6556-20 CONN IC DIP SOCKET 44POS GOLD Aries Electronics	1,170	-	RFQ	Datasheet	6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
24-3551-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	1,380	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
24-3552-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	2,389	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
24-3553-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	2,808	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
24-6551-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	1,873	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
24-6552-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	3,939	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
24-3554-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	1,077	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-

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