IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
40-6508-20

40-6508-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,789
RFQ
40-6508-20

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-6508-30

40-6508-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,010
RFQ
40-6508-30

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
299-93-608-10-002000

299-93-608-10-002000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,683
RFQ
299-93-608-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
20-3508-212

20-3508-212

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,387
RFQ
20-3508-212

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
20-3508-312

20-3508-312

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,884
RFQ
20-3508-312

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-93-642-41-003000

116-93-642-41-003000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

1,262
RFQ
116-93-642-41-003000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-642-41-003000

116-43-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,657
RFQ
116-43-642-41-003000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-47-964-41-117000

114-47-964-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

1,501
RFQ
114-47-964-41-117000

Datasheet

114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-328-41-002000

124-41-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,536
RFQ
124-41-328-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-428-41-002000

124-41-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,176
RFQ
124-41-428-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-628-41-002000

124-41-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,271
RFQ
124-41-628-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-328-41-002000

124-91-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,827
RFQ
124-91-328-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-428-41-002000

124-91-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,323
RFQ
124-91-428-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-628-41-002000

124-91-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,135
RFQ
124-91-628-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
23-0511-11

23-0511-11

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,708
RFQ
23-0511-11

Datasheet

511 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APH-1816-G-H

APH-1816-G-H

APH-1816-G-H

Samtec Inc.

1,135
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0916-G-H

APH-0916-G-H

APH-0916-G-H

Samtec Inc.

4,553
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0516-G-H

APH-0516-G-H

APH-0516-G-H

Samtec Inc.

2,359
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1016-G-H

APH-1016-G-H

APH-1016-G-H

Samtec Inc.

1,136
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1516-G-H

APH-1516-G-H

APH-1516-G-H

Samtec Inc.

1,606
RFQ

-

* - Active - - - - - - - - - - - - - - -
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