IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
48-6575-18

48-6575-18

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2,935
RFQ
48-6575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
7100265152

7100265152

TEXTOOLTEST & BURN-IN SPGA SOCKE

3M

1,278
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
40-3575-18

40-3575-18

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

4,584
RFQ
40-3575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6575-18

40-6575-18

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2,087
RFQ
40-6575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3553-18

48-3553-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3,684
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
2200-6321-9UA-1902

2200-6321-9UA-1902

TEXTOOLTEST & BURN-IN PGA KIT SO

3M

3,158
RFQ

-

Textool™ Bulk Active PGA, ZIF (ZIP) 200 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
1042-3-0560-OB-00

1042-3-0560-OB-00

TEXTOOL1042-3-0560-OB-00 1.27MM

3M

3,739
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
1019-2-0256-0B-00

1019-2-0256-0B-00

TEXTOOLTEST & BURN-IN BALL GRID

3M

4,220
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
48-3574-18

48-3574-18

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

4,884
RFQ
48-3574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
1031-2-0676-0B-00

1031-2-0676-0B-00

TEXTOOLTEST & BURN-IN BALL GRID

3M

2,762
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
1014-1-0257-0B-00

1014-1-0257-0B-00

TEXTOOL1014-1-0257-0B-00

3M

2,159
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
1029-2-0784-0B-00

1029-2-0784-0B-00

TEXTOOLTEST & BURN-IN BALL GRID

3M

1,508
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
1023-2-0324-0B-00

1023-2-0324-0B-00

TEXTOOLTEST & BURN-IN BALL GRID

3M

4,065
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
1017-2-0208-0B-01

1017-2-0208-0B-01

TEXTOOLTEST & BURN-IN BALL GRID

3M

2,799
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
1031-2-0900-0B-00

1031-2-0900-0B-00

TEXTOOLTEST & BURN-IN BALL GRID

3M

4,802
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
7010321972

7010321972

TEXTOOL1009-1-0048-0B-02L25

3M

2,613
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
3MM8591928

3MM8591928

BGA 1MM 25 25MM 23 MATRIX 168PIN

3M

1,661
RFQ

-

- - Obsolete - - - - - - - - - - - - - - -
400-PLS20001-16

400-PLS20001-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,465
RFQ
400-PLS20001-16

Datasheet

PLS Bulk Obsolete PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 200°C
7010402485

7010402485

TEXTOOLTEST & BURN-IN BALL GRID

3M

3,342
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
1021-1-0625-0B-00

1021-1-0625-0B-00

TEXTOOL1021-1-0625-0B-00

3M

1,316
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
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