| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
48-6575-18CONN IC DIP SOCKET ZIF 48POS GLD |
2,935 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
7100265152TEXTOOLTEST & BURN-IN SPGA SOCKE |
1,278 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
40-3575-18CONN IC DIP SOCKET ZIF 40POS GLD |
4,584 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
40-6575-18CONN IC DIP SOCKET ZIF 40POS TIN |
2,087 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
48-3553-18CONN IC DIP SOCKET ZIF 48POS |
3,684 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
|
2200-6321-9UA-1902TEXTOOLTEST & BURN-IN PGA KIT SO |
3,158 |
|
- |
Textool™ | Bulk | Active | PGA, ZIF (ZIP) | 200 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
1042-3-0560-OB-00TEXTOOL1042-3-0560-OB-00 1.27MM |
3,739 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1019-2-0256-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
4,220 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
48-3574-18CONN IC DIP SOCKET ZIF 48POS TIN |
4,884 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
1031-2-0676-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
2,762 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1014-1-0257-0B-00TEXTOOL1014-1-0257-0B-00 |
2,159 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1029-2-0784-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
1,508 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1023-2-0324-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
4,065 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1017-2-0208-0B-01TEXTOOLTEST & BURN-IN BALL GRID |
2,799 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1031-2-0900-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
4,802 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
7010321972TEXTOOL1009-1-0048-0B-02L25 |
2,613 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
3MM8591928BGA 1MM 25 25MM 23 MATRIX 168PIN |
1,661 |
|
- |
- | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
400-PLS20001-16CONN SOCKET PGA ZIF GOLD |
3,465 |
|
Datasheet |
PLS | Bulk | Obsolete | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
|
7010402485TEXTOOLTEST & BURN-IN BALL GRID |
3,342 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1021-1-0625-0B-00TEXTOOL1021-1-0625-0B-00 |
1,316 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |