IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
336-PLS21022-12

336-PLS21022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,701
RFQ
336-PLS21022-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7100285425

7100285425

TEXTOOLTEST & BURN-IN BALL GRID

3M

3,289
RFQ
7100285425

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
7010297751

7010297751

TEXTOOL1019-1-0484-0B-02L25

3M

1,342
RFQ
7010297751

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
42-3574-18

42-3574-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3,843
RFQ
42-3574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-3575-18

42-3575-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2,189
RFQ
42-3575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6574-18

42-6574-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2,416
RFQ
42-6574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6575-18

42-6575-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

4,515
RFQ
42-6575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
2676-9318-00-2401

2676-9318-00-2401

BGA SOCKET 1MM 676 POS 26X26

3M

2,328
RFQ

-

- - Obsolete BGA - - - - - - - - - - - - - -
7100186733

7100186733

TEXTOOLTEST & BURN-IN BALL GRID

3M

1,093
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
1027-2-0676-0B-00

1027-2-0676-0B-00

TEXTOOLTEST & BURN-IN BALL GRID

3M

1,483
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
400-PLS20001-12

400-PLS20001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,138
RFQ
400-PLS20001-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
400-PRS20001-12

400-PRS20001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,242
RFQ
400-PRS20001-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
1010-1-0100-0B-01

1010-1-0100-0B-01

TEXTOOL1010-1-0100-0B-01 PP4-661

3M

4,795
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
44-3574-18

44-3574-18

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

4,251
RFQ
44-3574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6574-18

44-6574-18

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

1,868
RFQ
44-6574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6575-18

44-6575-18

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

3,588
RFQ
44-6575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
2257-6321-9UA-1902

2257-6321-9UA-1902

TEXTOOL 2257-6321-9UA-1902 PGA 2

3M

3,336
RFQ

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
48-6574-18

48-6574-18

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

4,917
RFQ
48-6574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3575-18

44-3575-18

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

1,577
RFQ
44-3575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3575-18

48-3575-18

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

4,133
RFQ
48-3575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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