IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0826-G-T

APH-0826-G-T

APH-0826-G-T

Samtec Inc.

1,449
RFQ

-

* - Active - - - - - - - - - - - - - - -
HLS-0420-TT-18

HLS-0420-TT-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,559
RFQ
HLS-0420-TT-18

Datasheet

HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
517-83-428-19-101111

517-83-428-19-101111

CONN SOCKET PGA 428POS GOLD

Preci-Dip

4,447
RFQ
517-83-428-19-101111

Datasheet

517 Bulk Active PGA 428 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
44-6556-31

44-6556-31

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

2,561
RFQ
44-6556-31

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
517-83-429-19-101111

517-83-429-19-101111

CONN SOCKET PGA 429POS GOLD

Preci-Dip

2,462
RFQ
517-83-429-19-101111

Datasheet

517 Bulk Active PGA 429 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-43-950-61-007000

116-43-950-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,631
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-950-61-007000

116-93-950-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,766
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
558-10-192M16-001104

558-10-192M16-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

4,937
RFQ
558-10-192M16-001104

Datasheet

558 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-80-296-19-131135

550-80-296-19-131135

PGA SOLDER TAIL

Preci-Dip

2,390
RFQ
550-80-296-19-131135

Datasheet

550 Bulk Active PGA 296 (19 x 19) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-43-964-61-006000

116-43-964-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,140
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-964-61-006000

116-93-964-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,531
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
518-77-192M16-001105

518-77-192M16-001105

CONN SOCKET PGA 192POS GOLD

Preci-Dip

1,233
RFQ
518-77-192M16-001105

Datasheet

518 Bulk Active PGA 192 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-0434-G-H

APH-0434-G-H

APH-0434-G-H

Samtec Inc.

3,575
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1834-G-H

APH-1834-G-H

APH-1834-G-H

Samtec Inc.

1,175
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1534-G-H

APH-1534-G-H

APH-1534-G-H

Samtec Inc.

2,152
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1234-G-H

APH-1234-G-H

APH-1234-G-H

Samtec Inc.

2,234
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0234-G-H

APH-0234-G-H

APH-0234-G-H

Samtec Inc.

3,715
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0734-G-H

APH-0734-G-H

APH-0734-G-H

Samtec Inc.

2,876
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0834-G-H

APH-0834-G-H

APH-0834-G-H

Samtec Inc.

2,232
RFQ

-

* - Active - - - - - - - - - - - - - - -
APA-640-G-Q

APA-640-G-Q

ADAPTER PLUG

Samtec Inc.

1,533
RFQ
APA-640-G-Q

Datasheet

APA Tube Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
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