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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
ICA-640-AGG .100" SCREW MACHINE DIP SOCKET Samtec Inc.	1,181	-	RFQ	Datasheet	ICA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
714-93-264-31-012000 SOCKET CARRIER DUAL INLINE 64POS Mill-Max Manufacturing Corp.	2,911	-	RFQ	Datasheet	714	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
38-81000-610C CONN IC DIP SOCKET 38POS GOLD Aries Electronics	2,012	-	RFQ	Datasheet	8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
38-81250-610C CONN IC DIP SOCKET 38POS GOLD Aries Electronics	4,328	-	RFQ	Datasheet	8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
612-41-952-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2,604	-	RFQ	Datasheet	612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-91-952-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3,038	-	RFQ	Datasheet	612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-306-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,376	-	RFQ	-	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
126-93-652-41-001000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	1,768	-	RFQ	Datasheet	126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
126-43-652-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,714	-	RFQ	Datasheet	126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APH-1840-T-T APH-1840-T-T Samtec Inc.	1,265	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1540-T-T APH-1540-T-T Samtec Inc.	3,182	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1740-T-T APH-1740-T-T Samtec Inc.	3,117	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
614-93-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	1,039	-	RFQ	Datasheet	614	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-43-650-41-001000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2,844	-	RFQ	Datasheet	614	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
48-6508-20 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2,103	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
48-6508-30 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	4,982	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
123-13-432-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	1,604	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-13-632-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	4,074	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-43-642-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2,559	-	RFQ	Datasheet	612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-93-642-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3,573	-	RFQ	Datasheet	612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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