IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-43-432-61-001000

110-43-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,859
RFQ

-

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-652-41-002000

126-41-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,730
RFQ
126-41-652-41-002000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-652-41-002000

126-91-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,073
RFQ
126-91-652-41-002000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
29-0511-11

29-0511-11

CONN SOCKET SIP 29POS GOLD

Aries Electronics

4,176
RFQ
29-0511-11

Datasheet

511 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-3570-11

24-3570-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

1,660
RFQ
24-3570-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6573-11

24-6573-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,773
RFQ
24-6573-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
APH-1920-G-H

APH-1920-G-H

APH-1920-G-H

Samtec Inc.

3,885
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0920-G-H

APH-0920-G-H

APH-0920-G-H

Samtec Inc.

2,108
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1420-G-H

APH-1420-G-H

APH-1420-G-H

Samtec Inc.

1,886
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1020-G-H

APH-1020-G-H

APH-1020-G-H

Samtec Inc.

2,105
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1520-G-H

APH-1520-G-H

APH-1520-G-H

Samtec Inc.

3,868
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0620-G-H

APH-0620-G-H

APH-0620-G-H

Samtec Inc.

4,027
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1320-G-H

APH-1320-G-H

APH-1320-G-H

Samtec Inc.

3,530
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1720-G-H

APH-1720-G-H

APH-1720-G-H

Samtec Inc.

4,572
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0820-G-H

APH-0820-G-H

APH-0820-G-H

Samtec Inc.

3,268
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0420-G-H

APH-0420-G-H

APH-0420-G-H

Samtec Inc.

1,625
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-91-648-61-001000

110-91-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,320
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-93-640-41-002000

124-93-640-41-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

4,727
RFQ
124-93-640-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-43-640-41-002000

124-43-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,675
RFQ
124-43-640-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-952-41-001000

126-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,195
RFQ
126-41-952-41-001000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER