IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-41-642-41-001000

116-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,873
RFQ
116-41-642-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-642-41-001000

116-91-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,375
RFQ
116-91-642-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
316-93-132-41-001000

316-93-132-41-001000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

2,255
RFQ
316-93-132-41-001000

Datasheet

316 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-163-31-018000

714-43-163-31-018000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

2,149
RFQ
714-43-163-31-018000

Datasheet

714 Bulk Active SIP 63 (1 x 63) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
48-6556-30

48-6556-30

UNIVERSAL TEST SOCKET 48POS

Aries Electronics

2,984
RFQ

-

6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
48-3551-10

48-3551-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,472
RFQ
48-3551-10

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
60-9513-11H

60-9513-11H

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

3,409
RFQ
60-9513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0432-T-R

APH-0432-T-R

APH-0432-T-R

Samtec Inc.

1,631
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1832-T-R

APH-1832-T-R

APH-1832-T-R

Samtec Inc.

4,927
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0932-T-R

APH-0932-T-R

APH-0932-T-R

Samtec Inc.

2,745
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1032-T-R

APH-1032-T-R

APH-1032-T-R

Samtec Inc.

1,942
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1932-T-R

APH-1932-T-R

APH-1932-T-R

Samtec Inc.

4,477
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0632-T-R

APH-0632-T-R

APH-0632-T-R

Samtec Inc.

3,557
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1632-T-R

APH-1632-T-R

APH-1632-T-R

Samtec Inc.

3,358
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1232-T-R

APH-1232-T-R

APH-1232-T-R

Samtec Inc.

1,117
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1132-T-R

APH-1132-T-R

APH-1132-T-R

Samtec Inc.

2,512
RFQ

-

* - Active - - - - - - - - - - - - - - -
614-41-648-31-012000

614-41-648-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,212
RFQ
614-41-648-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-648-31-012000

614-91-648-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,521
RFQ
614-91-648-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-650-41-003000

116-93-650-41-003000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

4,972
RFQ
116-93-650-41-003000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-650-41-003000

116-43-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,296
RFQ
116-43-650-41-003000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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