IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
612-41-640-41-003000

612-41-640-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,391
RFQ
612-41-640-41-003000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-640-41-003000

612-91-640-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,830
RFQ
612-91-640-41-003000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-640-41-770000

104-13-640-41-770000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,979
RFQ
104-13-640-41-770000

Datasheet

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
116-41-650-41-008000

116-41-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,402
RFQ
116-41-650-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-650-41-008000

116-91-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,077
RFQ
116-91-650-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1818-G-T

APH-1818-G-T

APH-1818-G-T

Samtec Inc.

1,179
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1918-G-T

APH-1918-G-T

APH-1918-G-T

Samtec Inc.

3,665
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0618-G-T

APH-0618-G-T

APH-0618-G-T

Samtec Inc.

1,789
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1118-G-T

APH-1118-G-T

APH-1118-G-T

Samtec Inc.

4,951
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0218-G-T

APH-0218-G-T

APH-0218-G-T

Samtec Inc.

2,385
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1318-G-T

APH-1318-G-T

APH-1318-G-T

Samtec Inc.

4,076
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0718-G-T

APH-0718-G-T

APH-0718-G-T

Samtec Inc.

4,225
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1618-G-T

APH-1618-G-T

APH-1618-G-T

Samtec Inc.

3,898
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0818-G-T

APH-0818-G-T

APH-0818-G-T

Samtec Inc.

1,816
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1218-G-T

APH-1218-G-T

APH-1218-G-T

Samtec Inc.

4,387
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0318-G-T

APH-0318-G-T

APH-0318-G-T

Samtec Inc.

3,485
RFQ

-

* - Active - - - - - - - - - - - - - - -
133-PGM13046-10

133-PGM13046-10

CONN SOCKET PGA GOLD

Aries Electronics

3,267
RFQ
133-PGM13046-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
133-PGM14013-10

133-PGM14013-10

CONN SOCKET PGA GOLD

Aries Electronics

4,879
RFQ
133-PGM14013-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
160-PGM15056-10

160-PGM15056-10

CONN SOCKET PGA GOLD

Aries Electronics

1,593
RFQ
160-PGM15056-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-83-121-13-061112

614-83-121-13-061112

CONN SOCKET PGA 121POS GOLD

Preci-Dip

4,330
RFQ
614-83-121-13-061112

Datasheet

614 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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