IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-41-632-61-001000

110-41-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,377
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-632-61-001000

110-44-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,717
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
18-3508-21

18-3508-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,454
RFQ
18-3508-21

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
18-3508-31

18-3508-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,121
RFQ
18-3508-31

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
299-93-612-10-002000

299-93-612-10-002000

CONN IC DIP SOCKET 12POS GOLD

Mill-Max Manufacturing Corp.

3,243
RFQ
299-93-612-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-642-41-007000

116-93-642-41-007000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

4,852
RFQ
116-93-642-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-642-41-007000

116-43-642-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,533
RFQ
116-43-642-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1916-G-R

APH-1916-G-R

APH-1916-G-R

Samtec Inc.

4,107
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0916-G-R

APH-0916-G-R

APH-0916-G-R

Samtec Inc.

2,937
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1416-G-R

APH-1416-G-R

APH-1416-G-R

Samtec Inc.

1,364
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0516-G-R

APH-0516-G-R

APH-0516-G-R

Samtec Inc.

1,011
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1016-G-R

APH-1016-G-R

APH-1016-G-R

Samtec Inc.

3,964
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1516-G-R

APH-1516-G-R

APH-1516-G-R

Samtec Inc.

3,788
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1116-G-R

APH-1116-G-R

APH-1116-G-R

Samtec Inc.

2,049
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1616-G-R

APH-1616-G-R

APH-1616-G-R

Samtec Inc.

1,883
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0416-G-R

APH-0416-G-R

APH-0416-G-R

Samtec Inc.

2,265
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1716-G-R

APH-1716-G-R

APH-1716-G-R

Samtec Inc.

4,677
RFQ

-

* - Active - - - - - - - - - - - - - - -
123-93-324-41-801000

123-93-324-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,589
RFQ
123-93-324-41-801000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-324-41-801000

123-43-324-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,917
RFQ
123-43-324-41-801000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-314-41-801000

122-13-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,817
RFQ
122-13-314-41-801000

Datasheet

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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