IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
614-41-642-31-018000

614-41-642-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,682
RFQ
614-41-642-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-642-31-018000

614-91-642-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,431
RFQ
614-91-642-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-310-61-001000

110-99-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,109
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
38-6823-90T

38-6823-90T

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

2,252
RFQ
38-6823-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
614-41-640-41-001000

614-41-640-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,935
RFQ
614-41-640-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-640-41-001000

614-91-640-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,918
RFQ
614-91-640-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-11-950-41-001000

110-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,787
RFQ
110-11-950-41-001000

Datasheet

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0417-T-2

HLS-0417-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,179
RFQ
HLS-0417-T-2

Datasheet

HLS Bulk Active SIP 68 (4 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
APH-1340-T-H

APH-1340-T-H

APH-1340-T-H

Samtec Inc.

4,538
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0840-T-H

APH-0840-T-H

APH-0840-T-H

Samtec Inc.

2,150
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1440-T-H

APH-1440-T-H

APH-1440-T-H

Samtec Inc.

4,137
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0440-T-H

APH-0440-T-H

APH-0440-T-H

Samtec Inc.

1,237
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1840-T-H

APH-1840-T-H

APH-1840-T-H

Samtec Inc.

4,775
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1540-T-H

APH-1540-T-H

APH-1540-T-H

Samtec Inc.

3,165
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1040-T-H

APH-1040-T-H

APH-1040-T-H

Samtec Inc.

4,500
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1740-T-H

APH-1740-T-H

APH-1740-T-H

Samtec Inc.

4,007
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1640-T-H

APH-1640-T-H

APH-1640-T-H

Samtec Inc.

1,535
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-43-306-61-001000

110-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,656
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-306-61-001000

110-44-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,673
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0511-11

25-0511-11

CONN SOCKET SIP 25POS GOLD

Aries Electronics

1,399
RFQ
25-0511-11

Datasheet

511 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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