IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
614-43-632-31-007000

614-43-632-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,894
RFQ
614-43-632-31-007000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-47-964-41-001000

111-47-964-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,216
RFQ
111-47-964-41-001000

Datasheet

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
29-0501-21

29-0501-21

CONN SOCKET SIP 29POS GOLD

Aries Electronics

3,398
RFQ
29-0501-21

Datasheet

501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
38-0501-20

38-0501-20

CONN SOCKET SIP 38POS TIN

Aries Electronics

1,342
RFQ
38-0501-20

Datasheet

501 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-47-764-41-005000

117-47-764-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

3,520
RFQ
117-47-764-41-005000

Datasheet

117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-47-664-41-005000

117-47-664-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

4,571
RFQ
117-47-664-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0314-G-11

HLS-0314-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,299
RFQ
HLS-0314-G-11

Datasheet

HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
322-93-132-41-001000

322-93-132-41-001000

SOCKET 2 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.

1,780
RFQ
322-93-132-41-001000

Datasheet

322 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
23-0508-21

23-0508-21

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,003
RFQ
23-0508-21

Datasheet

508 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
23-0508-31

23-0508-31

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,675
RFQ
23-0508-31

Datasheet

508 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
HLS-0220-T-12

HLS-0220-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,367
RFQ
HLS-0220-T-12

Datasheet

HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
48-6503-30

48-6503-30

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

4,809
RFQ
48-6503-30

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0813-TT-22

HLS-0813-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,947
RFQ
HLS-0813-TT-22

Datasheet

HLS Bulk Active SIP 104 (8 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
123-93-318-41-801000

123-93-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

1,310
RFQ
123-93-318-41-801000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0220-T-18

HLS-0220-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,706
RFQ
HLS-0220-T-18

Datasheet

HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
124-93-324-41-002000

124-93-324-41-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

4,603
RFQ
124-93-324-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-93-424-41-002000

124-93-424-41-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

1,897
RFQ
124-93-424-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-93-624-41-002000

124-93-624-41-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,676
RFQ
124-93-624-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-43-324-41-002000

124-43-324-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,688
RFQ
124-43-324-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-43-424-41-002000

124-43-424-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,414
RFQ
124-43-424-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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