IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-41-636-41-008000

116-41-636-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,740
RFQ
116-41-636-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-636-41-008000

116-91-636-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,144
RFQ
116-91-636-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
50-9518-11H

50-9518-11H

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

4,500
RFQ
50-9518-11H

Datasheet

518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
712-13-120-41-001000

712-13-120-41-001000

CONN SOCKET SIP 20POS GOLD

Mill-Max Manufacturing Corp.

2,069
RFQ
712-13-120-41-001000

Datasheet

712 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-93-210-41-002000

124-93-210-41-002000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,845
RFQ
124-93-210-41-002000

Datasheet

124 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-43-210-41-002000

124-43-210-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,017
RFQ
124-43-210-41-002000

Datasheet

124 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-93-650-41-117000

114-93-650-41-117000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3,553
RFQ
114-93-650-41-117000

Datasheet

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-43-650-41-117000

114-43-650-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,715
RFQ
114-43-650-41-117000

Datasheet

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1816-G-T

APH-1816-G-T

APH-1816-G-T

Samtec Inc.

3,915
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0916-G-T

APH-0916-G-T

APH-0916-G-T

Samtec Inc.

4,431
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1116-G-T

APH-1116-G-T

APH-1116-G-T

Samtec Inc.

1,411
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0416-G-T

APH-0416-G-T

APH-0416-G-T

Samtec Inc.

4,762
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1216-G-T

APH-1216-G-T

APH-1216-G-T

Samtec Inc.

2,579
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0316-G-T

APH-0316-G-T

APH-0316-G-T

Samtec Inc.

1,610
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0716-G-T

APH-0716-G-T

APH-0716-G-T

Samtec Inc.

3,314
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1716-G-T

APH-1716-G-T

APH-1716-G-T

Samtec Inc.

2,741
RFQ

-

* - Active - - - - - - - - - - - - - - -
217-91-764-41-005000

217-91-764-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,762
RFQ
217-91-764-41-005000

Datasheet

217 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-648-WGT-3

ICA-648-WGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,590
RFQ
ICA-648-WGT-3

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
38-6823-90

38-6823-90

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

1,662
RFQ
38-6823-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
116-93-636-41-003000

116-93-636-41-003000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

1,539
RFQ
116-93-636-41-003000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER