IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-41-652-41-105000

110-41-652-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,135
RFQ
110-41-652-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-952-41-105000

110-41-952-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,525
RFQ
110-41-952-41-105000

Datasheet

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-652-41-105000

110-91-652-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,220
RFQ
110-91-652-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-952-41-105000

110-91-952-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,523
RFQ
110-91-952-41-105000

Datasheet

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-10-084-13-081101

550-10-084-13-081101

PGA SOLDER TAIL

Preci-Dip

1,958
RFQ
550-10-084-13-081101

Datasheet

550 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
124-93-316-41-002000

124-93-316-41-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,221
RFQ
124-93-316-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-43-316-41-002000

124-43-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,230
RFQ
124-43-316-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-11-640-41-001000

210-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,489
RFQ
210-11-640-41-001000

Datasheet

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-91-328-41-001000

123-91-328-41-001000

SOCKET IC OPEN 3 LVL .300 28POS

Mill-Max Manufacturing Corp.

1,756
RFQ

-

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-91-428-41-001000

123-91-428-41-001000

SOCKET IC OPEN 3 LVL .400 28POS

Mill-Max Manufacturing Corp.

3,313
RFQ

-

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-91-628-41-001000

123-91-628-41-001000

SOCKET IC OPEN 3 LVL .600 28POS

Mill-Max Manufacturing Corp.

2,299
RFQ

-

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-328-41-001000

123-41-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,556
RFQ
123-41-328-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-428-41-001000

123-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,882
RFQ
123-41-428-41-001000

Datasheet

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-628-41-001000

123-41-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,744
RFQ
123-41-628-41-001000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-93-640-41-117000

114-93-640-41-117000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,076
RFQ
114-93-640-41-117000

Datasheet

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-43-640-41-117000

114-43-640-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,147
RFQ
114-43-640-41-117000

Datasheet

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0216-G-12

HLS-0216-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,505
RFQ
HLS-0216-G-12

Datasheet

HLS Tube Active SIP 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
8058-24G1

8058-24G1

CONN TRANSIST TO-5 10POS GOLD

TE Connectivity AMP Connectors

3,088
RFQ

-

8058 Bulk Obsolete Transistor, TO-5 10 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
HLS-0220-G-2

HLS-0220-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,926
RFQ
HLS-0220-G-2

Datasheet

HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
APA-422-G-N

APA-422-G-N

ADAPTER PLUG

Samtec Inc.

3,364
RFQ
APA-422-G-N

Datasheet

APA Tube Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
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