IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0834-T-H

APH-0834-T-H

APH-0834-T-H

Samtec Inc.

1,670
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0734-T-H

APH-0734-T-H

APH-0734-T-H

Samtec Inc.

2,021
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0234-T-H

APH-0234-T-H

APH-0234-T-H

Samtec Inc.

4,093
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-93-432-41-006000

116-93-432-41-006000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

1,402
RFQ
116-93-432-41-006000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-632-41-006000

116-93-632-41-006000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

1,735
RFQ
116-93-632-41-006000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-432-41-006000

116-43-432-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,466
RFQ
116-43-432-41-006000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-632-41-006000

116-43-632-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,126
RFQ
116-43-632-41-006000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-11-320-41-001000

122-11-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,233
RFQ
122-11-320-41-001000

Datasheet

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-11-420-41-001000

122-11-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,787
RFQ
122-11-420-41-001000

Datasheet

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-328-31-012000

614-41-328-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,238
RFQ
614-41-328-31-012000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-428-31-012000

614-41-428-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,830
RFQ
614-41-428-31-012000

Datasheet

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-628-31-012000

614-41-628-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,436
RFQ
614-41-628-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-328-31-012000

614-91-328-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,690
RFQ
614-91-328-31-012000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-428-31-012000

614-91-428-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,141
RFQ
614-91-428-31-012000

Datasheet

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-628-31-012000

614-91-628-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,635
RFQ
614-91-628-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-322-41-780000

104-13-322-41-780000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

4,753
RFQ
104-13-322-41-780000

Datasheet

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
104-13-422-41-780000

104-13-422-41-780000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,862
RFQ
104-13-422-41-780000

Datasheet

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
ICO-640-ZNGT

ICO-640-ZNGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,050
RFQ
ICO-640-ZNGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
110-11-640-41-001000

110-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,664
RFQ
110-11-640-41-001000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-47-648-41-006000

116-47-648-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

1,171
RFQ
116-47-648-41-006000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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