IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0926-T-T

APH-0926-T-T

APH-0926-T-T

Samtec Inc.

4,846
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0626-T-T

APH-0626-T-T

APH-0626-T-T

Samtec Inc.

3,933
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0826-T-T

APH-0826-T-T

APH-0826-T-T

Samtec Inc.

4,129
RFQ

-

* - Active - - - - - - - - - - - - - - -
115-44-422-41-003000

115-44-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,848
RFQ
115-44-422-41-003000

Datasheet

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0503-20

25-0503-20

CONN SOCKET SIP 25POS GOLD

Aries Electronics

1,851
RFQ
25-0503-20

Datasheet

0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
50-9518-10H

50-9518-10H

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

4,714
RFQ
50-9518-10H

Datasheet

518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
299-83-640-10-002101

299-83-640-10-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

1,016
RFQ
299-83-640-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-632-CGT

ICO-632-CGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,937
RFQ
ICO-632-CGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0210-G-32

HLS-0210-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,639
RFQ
HLS-0210-G-32

Datasheet

HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
123-47-306-41-001000

123-47-306-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

1,385
RFQ
123-47-306-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
16-0503-31

16-0503-31

CONN SOCKET SIP 16POS GOLD

Aries Electronics

1,006
RFQ
16-0503-31

Datasheet

0503 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
104-13-310-41-780000

104-13-310-41-780000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,877
RFQ
104-13-310-41-780000

Datasheet

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
ICA-640-WGT

ICA-640-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,369
RFQ
ICA-640-WGT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-640-ZAGT

ICA-640-ZAGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,215
RFQ
ICA-640-ZAGT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-640-ZAGT

ICO-640-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,969
RFQ
ICO-640-ZAGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
346-93-150-41-013000

346-93-150-41-013000

CONN SOCKET SIP 50POS GOLD

Mill-Max Manufacturing Corp.

4,198
RFQ
346-93-150-41-013000

Datasheet

346 Bulk Active SIP 50 (1 x 50) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-150-41-013000

346-43-150-41-013000

CONN SOCKET SIP 50POS GOLD

Mill-Max Manufacturing Corp.

2,083
RFQ
346-43-150-41-013000

Datasheet

346 Bulk Active SIP 50 (1 x 50) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-632-T-C

APA-632-T-C

ADAPTER PLUG

Samtec Inc.

4,820
RFQ
APA-632-T-C

Datasheet

APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
614-43-308-31-002000

614-43-308-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,855
RFQ
614-43-308-31-002000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-308-31-002000

614-93-308-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,816
RFQ
614-93-308-31-002000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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