IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-41-308-41-008000

116-41-308-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,760
RFQ
116-41-308-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-308-41-008000

116-91-308-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,911
RFQ
116-91-308-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-820-90C

24-820-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,273
RFQ
24-820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-822-90C

24-822-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,633
RFQ
24-822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-93-314-10-001000

110-93-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,349
RFQ
110-93-314-10-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1814-T-H

APH-1814-T-H

APH-1814-T-H

Samtec Inc.

4,844
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0914-T-H

APH-0914-T-H

APH-0914-T-H

Samtec Inc.

4,174
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1514-T-H

APH-1514-T-H

APH-1514-T-H

Samtec Inc.

1,340
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1014-T-H

APH-1014-T-H

APH-1014-T-H

Samtec Inc.

1,177
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0614-T-H

APH-0614-T-H

APH-0614-T-H

Samtec Inc.

4,867
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1614-T-H

APH-1614-T-H

APH-1614-T-H

Samtec Inc.

3,805
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0314-T-H

APH-0314-T-H

APH-0314-T-H

Samtec Inc.

3,422
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0714-T-H

APH-0714-T-H

APH-0714-T-H

Samtec Inc.

4,697
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0414-T-H

APH-0414-T-H

APH-0414-T-H

Samtec Inc.

4,220
RFQ

-

* - Active - - - - - - - - - - - - - - -
40-6518-11H

40-6518-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,009
RFQ
40-6518-11H

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
123-47-310-41-001000

123-47-310-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

4,387
RFQ
123-47-310-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-428-41-001000

110-47-428-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,909
RFQ
110-47-428-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-320-BGG

ICO-320-BGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,382
RFQ
ICO-320-BGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-624-JGG

ICO-624-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,183
RFQ
ICO-624-JGG

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-324-JGG

ICA-324-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,771
RFQ
ICA-324-JGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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