IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
28-3508-201

28-3508-201

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,300
RFQ
28-3508-201

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-3508-301

28-3508-301

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,041
RFQ
28-3508-301

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6508-301

28-6508-301

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,306
RFQ
28-6508-301

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6820-90C

28-6820-90C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,409
RFQ
28-6820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6822-90C

28-6822-90C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,127
RFQ
28-6822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6823-90C

28-6823-90C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,408
RFQ
28-6823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APA-422-G-A1

APA-422-G-A1

ADAPTER PLUG

Samtec Inc.

1,661
RFQ
APA-422-G-A1

Datasheet

APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-422-G-A1

APO-422-G-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,081
RFQ
APO-422-G-A1

Datasheet

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0510-G-T

APH-0510-G-T

APH-0510-G-T

Samtec Inc.

4,421
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0610-G-T

APH-0610-G-T

APH-0610-G-T

Samtec Inc.

2,862
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1710-G-T

APH-1710-G-T

APH-1710-G-T

Samtec Inc.

4,049
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1210-G-T

APH-1210-G-T

APH-1210-G-T

Samtec Inc.

2,659
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0410-G-T

APH-0410-G-T

APH-0410-G-T

Samtec Inc.

4,149
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0310-G-T

APH-0310-G-T

APH-0310-G-T

Samtec Inc.

3,768
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1410-G-T

APH-1410-G-T

APH-1410-G-T

Samtec Inc.

1,395
RFQ

-

* - Active - - - - - - - - - - - - - - -
104-11-310-41-770000

104-11-310-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,670
RFQ
104-11-310-41-770000

Datasheet

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-210-41-007000

116-41-210-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,165
RFQ
116-41-210-41-007000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-210-41-007000

116-91-210-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,815
RFQ
116-91-210-41-007000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-3575-10

24-3575-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

1,580
RFQ
24-3575-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6575-10

24-6575-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3,455
RFQ
24-6575-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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