IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
210-99-308-41-001000

210-99-308-41-001000

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.

3,658
RFQ
210-99-308-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-44-308-41-001000

210-44-308-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,766
RFQ
210-44-308-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
16-0508-21

16-0508-21

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,855
RFQ
16-0508-21

Datasheet

508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
16-0508-31

16-0508-31

CONN SOCKET SIP 16POS GOLD

Aries Electronics

1,976
RFQ
16-0508-31

Datasheet

508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
ICA-648-ZSGT

ICA-648-ZSGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,317
RFQ
ICA-648-ZSGT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0120-G-10

HLS-0120-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,656
RFQ
HLS-0120-G-10

Datasheet

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
16-1508-21

16-1508-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,330
RFQ
16-1508-21

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
16-1508-31

16-1508-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,685
RFQ
16-1508-31

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
38-6501-20

38-6501-20

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

3,433
RFQ
38-6501-20

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0312-T-10

HLS-0312-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,110
RFQ
HLS-0312-T-10

Datasheet

HLS Tube Active SIP 36 (3 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
346-93-141-41-013000

346-93-141-41-013000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

2,251
RFQ
346-93-141-41-013000

Datasheet

346 Bulk Active SIP 41 (1 x 41) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-141-41-013000

346-43-141-41-013000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

2,925
RFQ
346-43-141-41-013000

Datasheet

346 Bulk Active SIP 41 (1 x 41) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-318-JGG

ICA-318-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,874
RFQ
ICA-318-JGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
31-0508-20

31-0508-20

CONN SOCKET SIP 31POS GOLD

Aries Electronics

4,595
RFQ
31-0508-20

Datasheet

508 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
31-0508-30

31-0508-30

CONN SOCKET SIP 31POS GOLD

Aries Electronics

1,352
RFQ
31-0508-30

Datasheet

508 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-0508-20

24-0508-20

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,977
RFQ
24-0508-20

Datasheet

508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-0508-30

24-0508-30

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,828
RFQ
24-0508-30

Datasheet

508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-1508-20

24-1508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,212
RFQ
24-1508-20

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-1508-30

24-1508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,574
RFQ
24-1508-30

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
714-43-132-31-018000

714-43-132-31-018000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

2,235
RFQ
714-43-132-31-018000

Datasheet

714 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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