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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
APH-1608-G-R APH-1608-G-R Samtec Inc.	2,494	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0308-G-R APH-0308-G-R Samtec Inc.	4,911	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1808-G-R APH-1808-G-R Samtec Inc.	4,075	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0808-G-R APH-0808-G-R Samtec Inc.	4,641	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0408-G-R APH-0408-G-R Samtec Inc.	1,981	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-308-G-B ADAPTER PLUG Samtec Inc.	2,983	-	RFQ	Datasheet	APA	Bulk	Active	-	8 (2 x 4)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
APO-308-G-B .100" LOW PROFILE SCREW MACHINE Samtec Inc.	3,973	-	RFQ	Datasheet	APO	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
25-0508-20 CONN SOCKET SIP 25POS GOLD Aries Electronics	1,917	-	RFQ	Datasheet	508	Bulk	Active	SIP	25 (1 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
25-0508-30 CONN SOCKET SIP 25POS GOLD Aries Electronics	4,668	-	RFQ	Datasheet	508	Bulk	Active	SIP	25 (1 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
40-3513-11 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	4,588	-	RFQ	Datasheet	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
22-4508-20 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	3,936	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
22-4508-30 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	4,917	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
14-6810-90C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	3,776	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
836-AG11D CONN IC DIP SOCKET 36POS GOLD TE Connectivity AMP Connectors	3,130	-	RFQ	Datasheet	800	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
115-41-306-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,324	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-91-306-41-001000 SKT IC OPEN LOWPRO Mill-Max Manufacturing Corp.	2,229	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
32-6518-11H CONN IC DIP SOCKET 32POS GOLD Aries Electronics	4,174	-	RFQ	Datasheet	518	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
550-10-056-09-041101 PGA SOLDER TAIL Preci-Dip	1,182	-	RFQ	Datasheet	550	Bulk	Active	PGA	56 (9 x 9)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
40-C182-11 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	4,390	-	RFQ	Datasheet	EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
40-C212-11 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	1,404	-	RFQ	Datasheet	EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C

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