IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
510-83-181-17-001101

510-83-181-17-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3,128
RFQ
510-83-181-17-001101

Datasheet

510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-17-082101

510-83-181-17-082101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

4,946
RFQ
510-83-181-17-082101

Datasheet

510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-14-031101

510-83-181-14-031101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

2,346
RFQ
510-83-181-14-031101

Datasheet

510 Bulk Active PGA 181 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-15-001101

510-83-181-15-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3,893
RFQ
510-83-181-15-001101

Datasheet

510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-0501-20

18-0501-20

CONN SOCKET SIP 18POS TIN

Aries Electronics

3,429
RFQ
18-0501-20

Datasheet

501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-0501-30

18-0501-30

CONN SOCKET SIP 18POS TIN

Aries Electronics

4,467
RFQ
18-0501-30

Datasheet

501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-87-299-20-001101

510-87-299-20-001101

CONN SOCKET PGA 299POS GOLD

Preci-Dip

3,045
RFQ
510-87-299-20-001101

Datasheet

510 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-299-20-091101

510-87-299-20-091101

CONN SOCKET PGA 299POS GOLD

Preci-Dip

4,827
RFQ
510-87-299-20-091101

Datasheet

510 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-80-084-10-031101

550-80-084-10-031101

PGA SOLDER TAIL

Preci-Dip

2,001
RFQ
550-80-084-10-031101

Datasheet

550 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-80-084-13-081101

550-80-084-13-081101

PGA SOLDER TAIL

Preci-Dip

2,524
RFQ
550-80-084-13-081101

Datasheet

550 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
8060-1G34

8060-1G34

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

1,618
RFQ

-

8060 - Obsolete Transistor, TO-5 3 (Round) - Gold - - - - Solder - - - - - -
20-4508-20

20-4508-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,517
RFQ
20-4508-20

Datasheet

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-628-SGG-L

ICA-628-SGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,733
RFQ
ICA-628-SGG-L

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APO-624-T-C

APO-624-T-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,113
RFQ
APO-624-T-C

Datasheet

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
16-3508-301

16-3508-301

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,367
RFQ
16-3508-301

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-822-90

14-822-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,494
RFQ
14-822-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
510-87-300-21-001101

510-87-300-21-001101

CONN SOCKET PGA 300POS GOLD

Preci-Dip

1,373
RFQ
510-87-300-21-001101

Datasheet

510 Bulk Active PGA 300 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-318-STL-I

ICF-318-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,384
RFQ
ICF-318-STL-I

Datasheet

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-640-TL-I-TR

ICF-640-TL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,799
RFQ
ICF-640-TL-I-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICA-422-AGT

ICA-422-AGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,846
RFQ
ICA-422-AGT

Datasheet

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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